Teledyne e2v HiRel Electronics announced a high reliability partnership with Integra Technologies, where Teledyne will use Integra’s GaN on SiC RF power transistors to optimized power solutions for the space market.

Working with Integra, Teledyne e2v HiRel will provide high power RF devices for new LEO and GEO payloads. Teledyne will also offer high reliability options for Integra's GaN on SiC power devices and pallets for the defense market.

Brad Little, vice president and general manager of Teledyne e2v HiRel, said, “Our space customers are requesting RF power devices at higher power density levels and operating at higher frequencies. The combination of our expertise in providing space RF components along with Integra’s high performance RF GaN device technology and product portfolio will provide space payload engineers state-of-the-art power devices for insertion in their applications.”

Suja Ramnath, CEO of Integra, said, "We are excited to partner with Teledyne e2V, a market leader in hi-rel with deep domain expertise, to extend the application of our unique GaN on SiC technology and products into the growing space market."