The biannual IEEE COMCAS (Conference on Microwaves, Communications, Antennas, Electronic Systems) 2019 event took place 4-6 Nov in Tel Aviv, Israel with a solid turnout of attendees. It continues the tradition of providing a multidisciplinary forum for the exchange of ideas, research results, and industry experience in areas such as communications, antennas, Radar, RF and Microwave Circuits and Systems, and Bio-medical Engineering. The 2018 event previously drew more than 1600 participants from about 40 countries around the world and 2019 grew significantly to 1900 attendees.
The conference covered the following areas: Innovations in Technology, Digital AESA Radar, MW Circuits modeling and Simulation, Space Oriented technology, Thermal Management, Advanced Packaging, 5G and IoT. The keynotes were “Wireless Beyond 100 GHz: Opportunities and Challenges for 6G and Beyond,” presented by Prof. Theodore Rappaport of NYU WIRELESS and “Lifelong Learning in Nature and Machines,” given by Dr. Hava T. Siegelmann of DARPA. In addition, there was a special memorial session held in tribute to Harvey Kaylie, founder of Mini-Circuits, who revolutionized the industry by taking custom RF products and commercializing them into low cost, high volume products that could be delivered quickly.
The IEEE Electronic Packaging Society (EPS) provided a Packaging and Thermal Management program Track, which addressed issues of critical interest to the electronic industry, such as Design & Reliability, Heterogeneous Integration, WLP, Flip Chip, new Materials & Processes, and an in-depth exploration of thermal management challenges and opportunities. The event also hosted the IEEE Young Professionals event, WIE Session (Women in Engineering), and COMCAS WirelessApps session.
This year the event significantly increased the number of tutorials and of industry-oriented invited sessions, making the conference more relevant than ever. Emphasis continues to be on applications-oriented research and development, from antennas and devices to systems and software, including calibration and testing, automotive radar and communications, and 5G.
The COMCAS 2019 scientific program was comprised of about 230 technical presentations, talks and tutorials, arranged in 60 sessions over three days with up to 9 parallel sessions running concurrently for much of the time. The technical presentations, reviewed, selected and accepted from a larger group of submissions, will be included in IEEE-Xplore®.