As part of its Series B funding round, 3D Glass Solutions (3DGS) has secured an unspecified investment from aerospace and defense prime Lockheed Martin.
Based in Albuquerque, New Mexico, 3DGS is a private, late-stage manufacturing business focused on the fabrication of electronic systems and devices using photo-definable glass ceramics. 3DGS manufactures glass-based system-in-package devices and components using a patented, low loss photosensitive APEX® Glass technology, targeting various RF, photonics and other electronics applications. According to the company, its technology can integrate circuit functions previously unattainable.
3DGS owns the fundamental intellectual property for materials, design, systems and manufacturing of glass ceramic devices for electronics packaging.
“Lockheed Martin Ventures, the investment arm of Lockheed Martin, strategically invests in companies developing cutting-edge technologies within our existing businesses and new industries. We look forward to our relationship with 3DGS and gaining access to its advanced component design capability for high frequency and heterogeneous electronics applications that could be applied to help address the size, weight and power demands across Lockheed Martin’s platforms.” — Chris Moran, Lockheed Martin vice president for corporate development and general manager of Lockheed Martin Ventures
To make the technology more accessible to designers, 3DGS is working with National Instruments to develop a millimeter wave process design kit (PDK) for NI AWR software. A pre-release version was demonstrated at the 2019 International Microwave Symposium (IMS2019).