After moving into a new, state-of-the-art facility, SemiGen has made an additional capital investment exceeding $500,000 for new production, wafer fabrication and test equipment to support customer demand, according to the company.
With these upgrades, SemiGen is offering wafer processing of silicon wafers and ceramic substrates. Processing services include any combination of photolithography, wet etch, dry etch, metallization, grinding, polishing and in-process metrology.
The new equipment consists of improvements across the entire service platform, including:
- A new Mycronic MY300 pick and place system.
- Two new Westbond wire bonders.
- A new Centrotherm eutectic vacuum chamber.
- New HTOL/HTRB ovens.
- A new Disco DAD3220 dicing saw.
SemiGen also upgraded the company's RF/microwave test capabilities, including new equipment for performance testing and metrology tools. These recent investments in RF/microwave testing and environmental screening enabled SemiGen to offer high-reliability screening of amplifiers, FETs, MMICs, transistors, diodes and other RF and microwave components operating to millimeter wave frequencies.
Tests can be performed and delivered with full documentation in accordance with MIL-PRF-19500, MILPRF-38534 and MIL-PRF-38535 requirements. Element evaluation and screening options from Class H, Class K, TX, TXV, S-level and custom SCD requirements are available.
"I'm excited to be in a position to continue to invest in and grow this important domestic outsource business. Our CEO, Jim Morgan, has said we must do our best to help our customers augment their design, assembly and hi-rel testing and up-screening capabilities, and it feels great to see this new equipment getting up and running to do just that." — Tim Filteau, president of SemiGen
Based in the U.S., SemiGen offers outsourcing options to OEMs in the RF/microwave, military, space, homeland security, optical, medical device and commercial wireless markets. The company's services and products are designed to fill voids in the manufacturing supply chain and production floor.
SemiGen's design and manufacturing capabilities include wire bonding to Si, GaAs and GaN die, RF/microwave and PCB assembly, mixed signal digital and analog assembly, module repair and high frequency testing and upscreening services. Assembly capabilities comprise manual to fully automatic solutions.
In recent years, SemiGen has invested in coupling these services with in-stock product solutions, by carrying the diodes, active and passive semiconductor devices and bonding supplies needed for successful production of several types of solid-state, multi-function assemblies and components. Bonding supplies are available for online purchase.
SemiGen's team supports designs, builds prototypes and handles volume production runs within a new, 37,000 square foot facility with a class 10,000 clean room in Manchester, New Hampshire.