StratEdge Corp. will feature its new line of packages that meet the extreme demands of GaN and GaAs devices at the 2018 International Microwave Symposium (IMS). StratEdge packages meet the critical requirements of the telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole and MEMS markets.

StratEdge will showcase its complete line of post-fired and molded ceramic semiconductor packages operating from DC to 63+ GHz. These packages have electrical transition designs that ensure exceptionally low electrical losses and operate efficiently, even at the highest frequencies. All packages are lead-free and most meet RoHS and WEEE standards. In addition, StratEdge offers complete automated assembly and test services for these packages, including gold-tin solder die attach.

"IMS is the preeminent gathering of stakeholders in the field of RF, microwave and mmWave technologies," said Tim Going, president of StratEdge. "5G and its high-power infrastructure, IoT and advanced cellular technologies requiring RF and microwave frequencies will make package selection critical. IMS is a great opportunity for those involved to visit our booth and discuss their packaging requirements."

StratEdge will be exhibiting in Booth #1649, at IMS2018, on June 12-14 at the Pennsylvania Convention Center, Philadelphia, Pa.