Long Island, New York-based BJG Electronics Inc. announced an expanded product offering from its thriving RF/microwave business unit. The BJG-W and BJG-65 connector series are a response to the market’s demand for greater density and reduced weight. These micro-miniature, push-on, high performance, RF/microwave connectors are the latest addition to BJG’s family of RF Interconnect products. Performing at higher frequencies, both series are best suited for applications where precision and reliability are expected, including: defense, radar, satellite and test & measurement.
The BJG-W and BJG-65 Series boasts superior and repeatable RF properties with radial and axial misalignments. Constructed from qualified Mil-STD materials, both series feature robust and durable mechanical push-on interfaces. BJG’s team of industry-recognized experts designed the new series for ease of manufacturing and consistent, high-quality production. Key attributes for the new series include:
BJG W Interconnect Series
- Center to center spacing of 0.085 for increased package density
- Weighs less than 0.01 grams
- RF performance from DC to 100 GHz
BJG-65 Interconnect Series
- Center to center spacing of 0.065 in. for increased package density
- Weights less than 0.01 grams
- RF performance from DC to 110 GHz (sub-1 mm line size)
Complementing the product offering is a series of instrument grade test adapters for the needs of the test and measurement community.
The BJG RF/microwave business unit operates from two state of the art facilities in New Jersey and New York dedicated to designing, manufacturing and testing all manufactured RF/microwave products. BJG will debut the BJG-W and BJG-65 Interconnect Product Series at the IEEE International Microwave Symposium (IMS) 2018 in Philadelphia, Pa. from June 12-14.