The maximum output power requirements for LTE user equipment is specified by the 3GPP TS 36.521 specifications and contains requirements for both the maximum output power as well as the output power tolerance. This calculator allows you to determine the maximum power reduction for two component carriers.
Qorvo and Modelithics collaborate to provide designers with high-accuracy nonlinear simulation models for Qorvo GaN transistor devices. The Modelithics® Qorvo GaN Library has been developed using "best-in-class" measurement and modeling techniques. Modelithics is well-known for providing highly accurate measurement-based, advanced feature simulation models, offering powerful substrate and part-value scaling capability, instrumental in high frequency design. Modelithics' model libraries integrate seamlessly with the latest electronic design automation (EDA) simulation tools, and are thoroughly documented, with a model information data sheet for each model.
This calculator helps you calculate your power added efficiency (PAE), power dissipation and maximum junction temperature.
PAE is a measure rating the efficiency of a PA which considers the effect of the gain of the amplifier. PAE will be like efficiency when the gain of the amplifier is high.
Power dissipation is the process in which an electric device produces heat as an unwanted byproduct of its primary action. If a circuit current flows through a given element, losing voltage in the process, then the Pdiss by that circuit element is the product of the current and voltage (P = I x V).
Junction temperature is the highest operating temperature of the actual semiconductor in an electronic device.
For designing differential amplifier circuits and reducing design time from hours to minutes! The tool is easy to use and features an interactive user interface to quickly get you up and running.
The ADIsimPLL design tool is a comprehensive and easy-to-use PLL synthesizer design and simulation tool. All key non-linear effects that can impact PLL performance can be simulated, including phase noise, Fractional-N spurs, and anti-backlash pulse.
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CST Studio Suite
SIMULA, Dassault Systèmes
CST Studio Suite is an industry-leading EM simulation tool, with multiple solvers for suitable for a wide range of applications. This includes the CST MPHYSICS® STUDIO package of multiphysics solvers, comprising Stationary and Transient Thermal Solvers, a Conjugate Heat Transfer Solver for air flow and electronics cooling simulation, and Structural Mechanical Solver capable of calculating thermal expansion and deformation. The engineer can then import the deformed structure back into the EM simulation in order to calculate how thermal expansion detunes the device.
Cascaded Noise Figure Calculator
Pasternack's Cascaded Noise Figure Calculator computes the total noise and gain of cascaded amplifiers.
Complete RF Amplifier Design and Analysis Calculator
Given an amplifier or transistor's the S-parameters (scattering parameters), this calculator will analyze its stability, maximum gain, an even suggest a suitable conjugate L-matching network for a given load and source impedance of the circuit to which the amplifier will be connected.
Image Rejection Calculator
This tool displays the contours of constant image rejection as a function of phase and amplitude error. After the user inputs a specific error condition, the program computes the image rejection and displays the result on the graph along with the contours. This visual representation allows the user to see which error is most significant, thereby offering a path to improved performance.
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Mixer Spurs Calculator
José Luis Flores, AT4 Wireless
A new method for mixer spurs calculation has been developed which is easier and more straightforward to use than the traditional spurs chart approach when dealing with the frequency plan optimization in broadband double conversion transceivers suitable for applications as multi-band, multi-standard and Software Defined Radio. A full technical article describing this new method can be found here.
Power Added Efficiency Calculator
Pasternack's Power Added Efficiency Calculator returns efficiency on an amplifier from input, output, and DC power.
Thermal Analysis Calculator
The thermal analysis tool tackles the problem of estimating the rise in temperature between the ambient surrounding and the bottom of a packaged MMIC when attached to a printed circuit board (PCB) without the need for a full 3D thermal simulation environment. With this tool, engineers can now develop a reasonable estimate of temperature at the bottom of a package based upon the construction of the PCB. Users simply select the package type, the power dissipation inside the package, the PCB board material, the via construction, and the base plate temperature (typically 85 ºC). The calculator then determines the temperature rise through the PCB to the bottom of the package, under the following assumptions: the PCB is plated with 1 oz. copper (1.4 mils thick), the package is attached to the PCB with solder (2 mils thick), and the base plate is an ideal heat sink. With this estimate, an engineer can then decide if a more detailed thermal analysis is required.
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HeatWave Electro-Thermal Analysis Software is an IC thermal simulator for chips and stacked-die SiP. HeatWave works with several IC design tools, including Cadence Virtuoso. A version of the HeatWave solver is also available in Advanced Design System (ADS) for RFIC and MMIC applications.
ANSYS Icepak accurately predicts airflow, temperature and heat transfer in a wide variety of electronic and power electronic components and PCBs. It can also perform thermal analysis of system-level applications such as data centers, computers and telecommunications equipment.