Metrigraphics will be exhibiting at EDI CON USA 2017 in Boston, on September 12 through 13.

Available at Booth #239, Metrigraphics is excited to speak about their latest advances and share design guidelines on developing sub-micron level flexible thin film circuits used in microwave assemblies, biosensors and IoT and other small antennas. A unique additive process has been developed to layer thin film circuits directly on flexible polyimide material. Using additive photolithographic thin film processes, MicroFlex circuits can be manufactured with traces and spaces as small as 5 μm. They can also be delivered in complex, high-resolution shapes and patterns. These are produced with very thin layers of sputtered metal or thicker plated metal such as gold or copper.

Metrigraphics offers both single and multilayer MicroFlex circuits. Applications for single-layer circuits include invasive medical devices and in-vitro diagnostics. Multilayer MicroFlex circuits include additional conductive layers that are independently stacked, aligned and interconnected. Plated conductive vias connect the different layers as required. Metrigraphics offers via sizes down to 25 μm diameter.

Metrigraphics also has expertise in developing complex multilevel electroformed structures, such as waveguide transitions, transducers, filters, polarizers, cones, funnels, nebulizers, antenna feeds and more. Metrigraphics’ high precision electroforming process can be employed even when irregular two- or three-dimensional durable metal parts with micron-level mechanical features, and extremely smooth, flat, and fine-grained qualities, are needed with extremely tight tolerances and high repeatability. With a wide array of sizes and features from inches to microns available, Metrigraphics electroforming process can be used to manufacture RF, microwave and mmWave components and quasi-monolithic multifunctional devices.

The essential demands of low mass, small size, low cost and high repeatability of avionics and space borne systems are well matched with precision electroforming. As the electro-deposited layers are developed on reusable mandrel, highly accurate and repeatable geometries can be manufactured. This process enables monolithic multifunctional module manufacturing without butt-joints, soldering, splits, or weak points prone to stresses and RF leakage/ingress.