Laser Services is excited to be exhibiting in Boston at the 2017 EDI-CON conference September 12–13 in Booth #408. Attendees are invited to stop by and learn about how critical design-formanufacturability techniques can be applied to speed up the laser processing step and reduce waste of ceramic substrates used in circuit manufacturing. An advanced solder damming technique called laser ablation will also be discussed.

Laser Services specializes in stocking and quick-turn cutting and drilling of common RF and microwave materials, including alumina ceramic, frozen epoxies, PCB substrates and EMI absorbers and stocks brand name materials, like Coorstek, Ceramtec and Kyocera. These materials are used to construct passive and active RF and microwave devices and components, such as filters, amplifiers, attenuators, switches, mixers, hybrid assemblies and more.

Laser Services also offers laser welding and various value-added processing and assembly services for turnkey delivery. With over 25 high and low power lasers and other secondary processing tools, Laser Services is well equipped to help optimize what is often a critical step in the RF/Microwave supply chain. To learn more, visit