Laser Services is announcing their presence at the International Microwave Symposium (IMS) this week.
In the 5G/IoT Pavilion Booth #848 at IMS2017 in Honolulu June 6-8, two associated brands will be there to assist with unique substrate processing requirements. Microcircuit designers looking to reduce the cost, time and materials needed to fabricate their microelectronic circuits will find Laser Services a handy ally. Stocking all major brands of substrate material, Laser Services is an expert at cutting, drilling and scribing; as well as post-processing and ablation. As compared to water-jet cutting which allows for +/- 0.010 in feature tolerance, laser cutting can achieve +/- 0.001 in. A Tech Brief is available on their website which advises designers on locating circuit features, singulation methods, metallization steps and material properties and their best applications.
Sister company, Accumet, provides ultra-precise lapping, polishing and diamond cutting of ferrous and non-ferrous metals and ceramics. Lapping can be completed from 6 to 60 μin and polishing of materials is from 0.1 to 5 μin. Accumet can also scribe or dice rectangular or other odd shaped parts up to 0.150 in thick in geometries and as small as 0.005 in x 0.005 in. Accuracy can be held to +/-0.0003 in; repeatability to within 0.0001 in. Diamond machined edges/bevels and chamfers can be machined within 0.0005 in.