April 2016 Theme: IEEE MTT-S IMS 2016

February 22, 2016

April 2016 Theme:
IEEE MTT-S IMS 2016

APRIL 2016 ISSUE
This issue of Microwave Journal aims to be the Golden Gate Bridge that connects readers to the activities at MTT-S IMS 2016 in San Francisco in May. For those wanting to experience cable cars and discover what’s new in cable accessories the issue provides an insight into the latest technology featured and offers a unique perspective on how to make the most of the show.

Articles:

• Cover Feature:
The Big Merge – Qorvo and ADI give an insider’s look into the merger process
• IEEE MTT-S IMS Show Coverage:
IMS 2016 Conference and Exhibition Preview
IMS MicroApps special panel session: The 5G IoT Conundrum
Exhibitor list and floor plan
IMS Exhibitor product showcase

Plus
The MTT-S IMS coverage is supported by technical articles, special reports, industry news, product features and tech briefs.


Articles:

• Paving The Way For 5G Realization and Millimeter-Wave Communication Systems – Keysight Technologies and University of California San Diego
• What’s Driving the IoT? It’s Not Just Consumers – National Instruments
• Adaptive Gate Bias Module Ensures Amplifier Performance – NXP

Exhibitor Highlight
All advertisers in the April issue that are also MTT-S IMS exhibitors are eligible for a free new product listing in the IMS Product Showcase. To be included send approximately 80 words, together with a high resolution image of the product being featured to Barbara Walsh at bwalsh@mwjournal.com, by 25 February 2016.

Ad Close: March 15
Ad Material Due: March 21

BONUS DISTRIBUTION: Microwave Journal April issue

AUVSI Xponential
New Orleans. LA
May 2-5

IEEE MTT-S IMS
Delegate Bag Distribution
San Francisco, CA
May 22-27



EDI CON USA 2016 CFPs

EDI CON USA 2016, September 20-22, Boston, MA

EDI CON USA 2016, taking place September 20-22 in Boston, MA, at the Hynes Convention Center, is pleased to announce their Call for Papers. Authors are invited to submit technical oral session abstracts/proposals describing work in RF/microwave, EMC/EMI and high-speed digital electronic component or system-level design, modeling or testing. The EDI CON Technical Advisory Committee will review all submissions based on quality, relevance, impact and originality. Prospective authors are welcome to reference products in a design case study or as a proof of concept for a design methodology, as long as product references are presented in an appropriately non-commercial fashion. The deadline for abstract submissions is February 28. Detailed information on formatting and instructions for submitting an abstract or paper are available at www.ediconusa.com/papers2016.

www.ediconUSA.com

 

Media Kit & Editorial Calendar:

2016 Media Kit (PDF)

2016 Editorial Calendar (PDF)

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