Up Screening, LAT, Element Evaluation & More
For over three decades, Teledyne Microwave Solutions has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, TMS offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening.
TMS offers a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
- Full RF and DC testing up to 40 GHz
- Up Screening / LAT to MIL-PRF-19500, 38534, 38535 and MIL-STD-883 for Military and Space
- Space Level Screening: K-level, S-level, and H-level
- Up Screening & Testing of GaN devices
- Verification & Testing of Counterfeit Parts
- Space Level Screening & Qual for plastic encapsulated devices per NASA PEM-INST-001
- LAT and Up Screening on FETS & MMICs, Bipolar Transistors, and Diodes
- Packaging and Screening of Active Die
- Build to Print Assembly: simple die / complex hybrids, hermetic sealing, passive / active components