Qorvo™ Inc., a leading provider of core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications, announced a series of innovations intended to accelerate the deployment of high-speed cable TV (CATV) DOCSIS 3.1 networks while providing cable designers greater flexibility in product design. Qorvo's newest multi-chip module packaging, thermal sensing pins, and advanced gallium nitride on silicon carbide (GaN on SiC) integration capabilities enable CATV product designers to lower costs, increase bandwidth, and reduce board space.

50 percent board space savings now

Qorvo's multi-chip-module (MCM) packaging helps customers reduce board space by up to 50 percent versus traditional SOT115J packaging.

Qorvo's multi-chip-module (MCM) packaging helps customers reduce board space by up to 50 percent and enables up to 30 percent cost savings versus traditional SOT115J packaging. Qorvo's MCM packaging includes temperature-sensing pins, which ensure proper assembly and provide optimal thermal management. To facilitate the use of its newest advanced MCM capabilities, Qorvo offers customers PCB layout and thermal design support services.

Multi-system operators (MSOs) can leverage the market leading output and gain performance of Qorvo's GaN on SiC technology to upgrade equipment within existing product footprints, saving installation time and cost while enhancing performance. Additionally, Qorvo's GaN on SiC technology helps reduce overall power consumption by up to 20 percent with associated features such as adjustable current control.

Kellie Chong, director, CATV and Broadband Access products for Qorvo, said, "Qorvo is leveraging our broad portfolio of advanced packaging and process technologies to help leading CATV customers lower costs, increase bandwidth, and achieve significant board space savings. Qorvo has shipped more than two million CATV GaN amplifiers and is the industry-leading GaN supplier for the cable market. We are pleased to offer customers the benefits of our newest innovations to accelerate the deployment of their DOCSIS 3.1 networks."

Qorvo's newest DOCSIS 3.1 products include the RFCM3316 and RFCM3326 GaN-based power doubler amplifiers and are available in miniaturized 9mm x 8mm MCM packaging.

About Qorvo's DOCSIS 3.1 Products

Qorvo's DOCSIS 3.1 forward path amplifiers operate from 45MHz to 1.2GHz with very high output (capable of 74dBmV composite power), extremely low distortion (lower than 70dBc), and excellent input and output return loss (-20dB typical). Qorvo's reverse path amplifiers operate up to 300MHz with integrated attenuator and power down function.

Qorvo's DOCSIS 3.1 products are available in multi-chip module (MCM), SOT-115J, and standard monolithic microwave integrated circuit (MMIC) packages, including QFN, SOT89, and SOIC. Qorvo's MMIC products include gain amplifiers, low equivalent input noise current (EINC) trans-impedance amplifiers (TIA), attenuators, switches, filters, and complete optical receivers for RF over glass (RFoG) and passive optical network (PON) applications. Qorvo's DOCSIS 3.1 solutions employ the latest high-performance process technologies, including GaN high-electron-mobility transistor (HEMT) technology, which delivers superior linearity, output power and reliability. For more information about Qorvo's line of DOCSIS 3.1 products, download the Qorvo Broadband DOCSIS 3.1 brochure.

Qorvo will be exhibiting at the SCTE 2015 Cable-Tec Expo in New Orleans, LA, from October 14, 2015, through October 16, 2015.