Lee's presentation, "Shock Resistant and Thermally Reliable Low-Ag SAC Solder Doped with Mn for Portable Medical Devices," discusses a new soldering
alloy doped with Mn, and its considerable improvement in shock resistance and thermal fatigue performance.
Laskys presentation, "Tin Whiskers: Causes, Risks, and Mitigation," reviews what tin whiskers are, how they form, mitigation techniques, and how to use failure modes and effects analysis as techniques to assess tin whisker risk.
Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advance materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Lasky, holder of the prestigious SMTA Founder¹s Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 30 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Lasky also authors a technology blog, which can be found at www.indium.com/drlasky .