SemiGen, Inc. has announced today they have placed an order for a Palomar 8000 Auto Ball Bonder to round out their state-of-the-art RF/Microwave assembly line.

The Palomar Bonder will be used to compliment SemiGen’s MRSI eutectic die attach machine and address the RF/Microwave and optical market requirements for high-speed, ultra-precise, wire bonding. Jim Morgan, President of SemiGen, stated, “This was the last piece of our ultra-modernization plan for our assembly floor and puts us in the leadership position in the U.S. for RF/Microwave assembly and test. It gives us a true competitive advantage to address all markets and volumes.”

The Palomar 8000 Wire Bonder is a fully automated thermosonic high-speed, ball-and-stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles. It is the assembly method of choice for first level interconnection and is suitable for many aspects of packaging and component assembly, including complex hybrids, MCMs and high-reliability devices.

The planarBump™ feature, a patented technology that uses gold wire to produce tailless ball bumps, also makes that 8000 Wire Bonder suitable for flip chip and other advanced packaging applications. The overall precision of the 8000 Wire Bonder, along with its large work area and its available deep access capability, results in high-yield processing of fine pitch/high wire count applications.

The Palomar Technologies 8000 Wire Bonder also features continuous bonding technology – the ability to load parts onto the wire bonder while it is wire bonding.