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Items Tagged with 'footprint'
Richardson RFPD Inc. announces that it is taking orders for Xinger® III Femto Couplers, the newest addition to the Xinger® III family.
Custom MMIC, (www.CustomMMIC.com), a developer of performance-driven monolithic microwave integrated circuits, announces the introduction of the CMD172, a new voltage-variable attenuator (VVA) in die form operating from 18 to 40 GHz.
Linear Technology Corp. introduces the LTC2314-14, a 14 bit 4.5 Msps successive approximation register (SAR) ADC in a tiny 8-lead TSOT-23 package, offering up to 90% reduction in size over competing solutions for space-conscious applications. This small SAR ADC integrates a precision 2.048 V/4.096 V reference with 7 ppm/°C typical and guaranteed 20 ppm/°C maximum temperature coefficient into an 8 mm² footprint.
Richardson RFPD Inc. announced immediate availability and full design support capabilities for the Xinger®-III line of components from Anaren.