Global connectivity supplier HUBER+SUHNER unveils its new high speed digital testing solutions at DesignCon 2015. The company has chosen the Santa Clara event for the global launch of its MPX50 precision multicoax connector solution which combines the highest density, lowest loss and highest performance characteristics for cutting edge data rate testing in one testing solution.
Molex Inc. announced that it will exhibit at the IEEE 2014 International Microwave Symposium (IMS) in Tampa Bay, FL June 1-6. Molex will showcase its broad range of products and solutions available for the RF/microwave market in Booth 508.
Anritsu Co. establishes a new standard in broadband performance with the introduction of the VectorStar™ ME7838D broadband system that provides industry-best frequency coverage of 70 kHz to 145 GHz in a single sweep using a coaxial test port. The VectorStar ME7838D gives design engineers greater confidence when performing on-wafer device characterization at 70 GHz and beyond.
Pasternack Enterprises Inc., an industry leading manufacturer and supplier of RF, microwave and millimeter wave products, expands inventory of SMP and mini SMP connectors, specially designed for many wireless and military applications including high density interconnect modules, radar equipment, wireless base stations and medical lab equipment.
AtlanTecRF has two models of Zero Bias Schottky Detectors with high sensitivity and a wide operating temperature range. The first two frequency ranges offered are 10 MHz to 18 GHz and 2.0 to 8.0 GHz, both with sensitivity of 500 mV/mW and TSS of -50 dBm. Flatness over the 10 MHz to 18 GHz frequency band is +/-1.25 dB max and VSWR for each unit is 2.0:1.
The interface of the recently released Molex Inc. zCD™ active optical cable (AOC) interconnect solution has been selected by the industry leading CDFP MSA as the interface for the consortium’s 400 Gbps hot pluggable module. The zCD AOC assembly will be highlighted at Molex booth 3863, OFC 2014, March 11-13, San Francisco, CA.
TE Connectivity (TE), a world leader in connectivity, now offers a full complement of high-performance circular connectors, including DEUTSCH connectors, to its portfolio of circular connectors serving nanominiature, microminiature and compact small form factor applications.
The Molex SpeedStack™ mezzanine connector system provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications. Compact SpeedStack connectors feature a stack height of 4.00mm and support data rates up to 40 Gbps per differential pair. SpeedStack connectors will be displayed at Molex booth 117, DesignCon 2014.