Ardent Concepts Inc., a leading designer and manufacturer of high performance GHz connectors used in the development of next generation semiconductor applications and systems has again pushed bandwidth barriers with a 70 GHz configuration of its innovative TR Multicoax series connectors. TR 70 realizes Ardent’s mission to bring tomorrows connector solutions to market today. With exceptionally low loss, TR 70 ensures quicker, more accurate, and more repeatable functional test of cutting-edge IC applications.
RLC Electronics introduced a new line of GPO and Miniature-GPO connectorized filters. These filters are available in all filter topologies, including tubular, cavity/comb. and lumped element, in frequencies up to 26.5 GHz (GPO), 40 GHz (GPPO) and 65 GHz (G3PO).
TE Connectivity (TE), a world leader in connectivity, announces its new Fortis Zd LRM connector system, an innovative modular connector system for rugged, next-generation packaging from avionics boxes to military ground vehicles. It features a rugged, lightweight multi-bay shell that accepts high-speed digital signal, power, radio-frequency (RF) and optical modules.
Global connectivity supplier HUBER+SUHNER unveils its new high speed digital testing solutions at DesignCon 2015. The company has chosen the Santa Clara event for the global launch of its MPX50 precision multicoax connector solution which combines the highest density, lowest loss and highest performance characteristics for cutting edge data rate testing in one testing solution.
Molex Inc. announced that it will exhibit at the IEEE 2014 International Microwave Symposium (IMS) in Tampa Bay, FL June 1-6. Molex will showcase its broad range of products and solutions available for the RF/microwave market in Booth 508.
Anritsu Co. establishes a new standard in broadband performance with the introduction of the VectorStar™ ME7838D broadband system that provides industry-best frequency coverage of 70 kHz to 145 GHz in a single sweep using a coaxial test port. The VectorStar ME7838D gives design engineers greater confidence when performing on-wafer device characterization at 70 GHz and beyond.