Pat Hindle, MWJ Editor
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Hindle
Pat Hindle is responsible for editorial content, article review and special industry reporting for Microwave Journal magazine and its web site in addition to social media and special digital projects. Prior to joining the Journal, Mr. Hindle held various technical and marketing positions throughout New England, including Marketing Communications Manager at M/A-COM (Tyco Electronics), Product/QA Manager at Alpha Industries (Skyworks), Program Manager at Raytheon and Project Manager/Quality Engineer at MIT. Mr. Hindle graduated from Northeastern University - Graduate School of Business Administration and holds a BS degree from Cornell University in Materials Science Engineering.

Cloud Services Accelerating Virtual Design Services

OnScale Brings SaaS Scale to RF Design

OnScale is a leader in Cloud computer aided engineering (CAE), running multi-physics solvers on its Cloud HPC platform running on Amazon Web Servers. Their platform helps engineers to accelerate innovation for next-generation products such as 5G smartphones, IoT, biomedical devices and driverless car products by greatly reducing the solving time with massive computing power and using optimized algorithms.


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2 Gems Uncovered at IMS 2018

I recently attended the International Microwave Symposium (IMS) in Philadelphia. As mentioned in our wrap up, while the theme of IMS2018 was Microwaves, Medicine and Mobility, the real theme was 5G, 5G and 5G.


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Coming Soon - 100 Gbps Wireless

This week two separate news items, one from Tektronix/IEMN and the other from Nippon Telegraph and Telephone Corporation (NTT), both announced development of 100 Gbps “wireless fiber” solutions. Each took a different route with Tektronix and IEMN (a French research laboratory) demonstrating a single carrier wireless link with a 100 Gbps data rate signal at 252 to 325 GHz per the recently published IEEE 802.15.3d standard while NTT used a new principle, Orbital Angular Momentum (OAM) multiplexing at 28 GHz  with MIMO technology.


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5G Ready to Launch - Brooklyn 5G Summit Summary

The Brooklyn 5G Summit celebrated its 5th meeting for 2018 at NYU WIRELESS. Leaders and technologists from leading operators such as AT&T, DoCoMo, KT, T-Mobile US, Verizon and Vodafone discussed the latest results and plans for future 5G networks. In addition, major infrastructure leaders like Nokia, Ericsson and Huawei, plus smaller companies such as Phazer, Blue Danube, BluWireless and InterDigital, were on hand showing off the latest results and technology. It was the most exciting 5G Summit to date by many accounts, as the rollout of 5G starts this year with the accelerated standards and deployment schedule from a few years ago.


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Satellite 2018 Review - Snowed In!

I was suppose to fly down to DC on Tues  to spend a couple of days catching up on the newest trends and products at Satellite 2018. But the Nor'easter dumped 2 feet of snow on Boston and every flight I could find was cancelled. So I remotely monitored the happenings at the event and collected the following materials from press releases and emails about what was on display for RF/microwave products.


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Don’t underestimate 5G and IoT rollout

Lessons learned from MWC 2018

Mobile World Congress solidified that 5G is fast approaching with deployments this year. In the US, Verizon is rolling out 5G millimeter wave Fixed Wireless Access in many cities and AT&T is rolling out 5G mobile service. T-Mobile will not be far behind with their dual band 600 MHz and 28 GHz 5G rollout starting Q2 of next year.


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802.11ax Going Live

With all of the focus on 5G these days, we tend to forget about Wi-Fi which actually carries the bulk of mobile traffic relatively effortlessly. That is not typically the case at events where there are hundreds or thousands of people using their mobile devices in a confined area. But the upcoming generation of Wi-Fi, 802.11ax, will change those poor service experiences into noticeable better ones.


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Fujitsu Single-crystal Diamond Bonding Technology Will Enable Higher Performance GaN

Fujitsu Limited and Fujitsu Laboratories Ltd. announced last week the development of the first method for bonding single-crystal diamond to a SiC substrate at room temperature. Using this technology for heat dissipation in high-power GaN HEMT devices enables stable operation at higher power levels than currently used. Application of this technology is expected to significantly enhance the performance of radars and wireless communications since they can operate at higher powers.


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