Microwave Journal
MWJ China MWJ China
  • Sign In
  • Subscribe
  • Sign Out
  • My Account
Microwave Journal
  • News
  • Channels
    • 5G/Massive MIMO
    • Aerospace & Defense
    • Broadband
    • Cellular/4G/LTE
    • EMC/EMI
    • Industrial/Scientific/Medical
    • IoT/M2M/V2V
    • RFID/GPS/Location
    • RFIC
    • Software/EDA
    • Test & Measurement
  • eLearning
    • Webinars
    • Design Tools
    • 5G mmWave Training Course
    • Educational eBooks
    • White Papers
    • History of Wireless
    • Acronyms List
  • Community
    • Blogs
    • Classifieds Section
    • Polls
    • RF & Microwave LinkedIn Group
    • Facebook
    • Twitter
    • Instagram
    • Mobile App
  • Events
    • Webinars
    • Trade Shows
    • Training-User Meetings
    • European Microwave Week
    • EDI CON China
    • EDI CON USA
    • IMS MTT-S
  • Buyers Guide
  • Multimedia
    • Photo Galleries
    • Videos
  • Magazine
    • Current Issue
    • Archives
    • Article Reprints
    • Subscribe
    • Subscription Renewal
Home » Authors » Theodore Trembinski

Theodore Trembinski

Articles

ARTICLES

Substrate Attach Design Guidelines for Bonding Alumina to Aluminum

Guidelines for two adhesives to determine the minimum bond line thickness required for a given substrate size to withstand thermal cycling effects
September 1, 1997
Theodore Trembinski
No Comments
Substrate Attach Design Guidelines for Bonding Alumina to Aluminum In an effort to achieve higher density microelectronic packages, various ceramic substrate packaging techniques are being introduced. For instance, one of these techniques eliminates the need for a carrier so that a substrate is bonded directly to a housing. The...
Read More
  • Free Newsletter
    • Subscribe Now

Current Issue

April-2018
Digital Edition
Design of a Single Chip Front-End Module for 28 GHz 5GUltra-Low Phase Noise Oscillators with Attosecond JitterRF Probe for Ultra-Low Temperature ApplicationsHigh Performance, Cost-Effective VNA Test CablesNew Products

Buyer's Guide

Cpi_bmdcolorlogo1Buyer's GuideGet Listed

Popular Posts

  • Design of a Single Chip Front-End Module for 28 GHz 5G
  • Thales Partners with Canadian Governments to Develop 5G Superhighway
  • ZTE, China Unicom Announce Commercialization of Magic Pole Small Cell Solution
  • Raytheon Downs UAVs with High-Power Microwaves and Lasers
  • Filtronic and Nokia Develop FDD-LTE Massive MIMO Antenna

Featured Videos

Frequency Matters #100 - MWJ Interviews ADI and Autoliv About Advanced Automotive Radar Sensors

See More Videos

Subscribe here to receive Microwave Journal

Design of a Single Chip Front-End Module for 28 GHz 5G

By Stuart Glynn, Robert Smith, Liam Devlin, Andy Dearn and Graham Pearson, Plextek RFI Ltd., U.K.

Subscribe

Ultra-Low Phase Noise Oscillators with Attosecond Jitter

By Andreas Gronefeld, Ingenieurbüro Gronefeld, Germany

RF Probe for Ultra-Low Temperature Applications

By INGUN USA Inc., Lake Wylie, S.C.
April-2018
Digital Edition
Online Edition
  • Home
  • About Us
  • Contact Us
  • Advertise With Us
  • Submit An Article
  • ERB Members
  • Reprints
  • Privacy

Microwave Journal

685 Canton St.
Norwood, MA 02062 USA
Tel: (781) 769-9750
Fax: (781) 769-5037

For magazine subscriptions and newsletter customer service:

Tel: 978-671-0449
Email: mwj@e-circ.net

SIJ
EDI CON 2018 Footer
Microwave Journal
Copyright ©2018. All Rights Reserved
Design, CMS, Hosting & Web Development | ePublishing