EDI CON USA

EDI CON

EDI CON USA 2017 Announces Short Courses

Opening day of the conference features in-depth training with three-hour short courses on RF, microwave and high-speed digital design.

The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced the addition of a full day of training to its conference program at the Hynes Convention Center, September 11-13 in Boston, Mass.


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EDICON radar summit

EDI CON USA 2017 Announces European Radar Summit

Leading RADAR speakers bring expertise to event that covers RF/microwave and high-speed digital topics.

The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced the addition of the European Radar Summit to its conference program at the Hynes Convention Center, September 11-13 in Boston, Mass.


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EDI CON USA 2017 Opens Call for Abstracts

RF/Microwave and High-Speed Digital Topics Welcome

EDI CON USA 2017 announces that this year’s call for abstracts (CFA) is now open. The EDI CON USA Technical Advisory Committee, event management team, and this year’s conference chairs, Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. and Istvan Novak, Senior Principal Engineer at Oracle, worked in conjunction to develop the CFA. 


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EDI CON USA Announces 2017 Event: Save the Date!

Bringing together engineers working in RF/microwave with those working in high-speed digital, EDI CON USA offers an opportunity to learn from other disciplines and transfer techniques and methods between applications. The exhibit floor will include booths from industry-leading companies working in both of these areas, as well as feature the SI ZONE, a specialized demo area for signal integrity, power integrity and EMI/EMC products. 


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High Frequency and High Speed Design Engineers Unite in Boston

EDI CON USA Complete Show Review

The inaugural EDI CON USA conference and exhibition took place on September 20-22, 2016 at the Hynes Convention Center in Boston, Mass.  Nearly 1500 attendees took advantage of the opportunity to meet one-on-one with more than 140 exhibitors from the RF, microwave and high-speed digital industries. Here is a complete review of the event.


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T-Tech Inc. announces release of IsoPro CNC2PCB software.

T-Tech Inc. the manufacturer of the Quick Circuit rapid prototyping system announces CNC2PCB®. The new software application allows you to output your DXF data, Gerber data, or NC Drill data to computer numerical control programs. By following the EIA RS-274 industry standard, the output from CNC2PCB allows you to fabricate your PCB or chassis on your milling center in your mechanical engineering department.


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Horizon House Publications launches industry’s first Signal Integrity Journal

Horizon House Publications announces the launch of Signal Integrity Journal, a sister publication to Microwave Journal, covering signal integrity, power integrity and EMC/EMI related topics. Signal Integrity Journal will be the first peer reviewed, industry journal to cover these markets. Signal Integrity Journal is initially launching as a website, www.signalintegrityjournal.com, and plans to start publication of the periodical journal in 2017. The website is now available as a beta version with content being added quickly for full release shortly.


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