EDI CON USA

EDI CON USA Adds IBIS Summit to Its Premier Program Line-Up

IBIS Open Forum Calls for Participation and Presentations

EDI CON USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced that IBIS Open Forum will hold its first, formal IBIS Summit Meeting at EDI CON USA 2017 at the Hynes Convention Center, September 11-13 in Boston, Mass.


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EDI CON USA 2017 Launches Scholarship Program

Open to any student interested in high frequency or high-speed electronics

EDI CON USA 2017 announces a new scholarship program for university students, where any student that attends can enter the drawing for a one of two $500 scholarships being given away by visiting the booths of major sponsors on September 12-13.


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EDI CON USA 2017 Launches Scholarship Program

Open to any student interested in high frequency or high-speed electronics

EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, announces a new scholarship program for university students interested in high frequency or high-speed electronics. Any student that attends EDI CON USA 2017 can enter the drawing for a one of two $500 scholarships being given away by visiting the booths of three major sponsors in the exhibition Sept 12-13.


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Analog Devices Signs On as Host Sponsor of EDI CON USA 2017

ADI takes the lead sponsorship position at EDI CON USA, supporting networking and training opportunities for engineers working in high-frequency and high-speed applications.

EDI CON USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced that Analog Devices, Inc. (ADI) is taking on the role of host sponsor of the exhibition and conference program at the Hynes Convention Center, September 11-13 in Boston, Mass.


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EDI CON USA 2017 Announces Short Courses

Opening day of the conference features in-depth training with three-hour short courses on RF, microwave and high-speed digital design.

The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced the addition of a full day of training to its conference program at the Hynes Convention Center, September 11-13 in Boston, Mass.


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