RF & Microwave Industry News

Nusil presents easy-to-use film adhesive with low outgassing

NuSil Technology LLC (http://www.nusil.com), a formulator and manufacturer of silicone compounds for the aerospace, aircraft, electronics and photonics industries, announces the release of CV-2681-12, an electrically conductive, controlled volatility (low outgassing) film adhesive designed for a wide range of applications, from tacking down wires to working with solar cells and mirrors.


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RFMD introduces WiFi front end modules at IMS 2012

RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD’s FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world’s leading WiFi chipset providers.


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Rogers introduces Condux Plus conductive foams

Rogers Corp.s High Performance Foams Division has introduced a new problem-solving material for handheld mobile devices — Condux Plus™ electrically conductive foam. Even in the most complex, compact handheld electronic designs, Condux Plus materials feature excellent electrical conductivity, consistent mechanical properties, and outstanding electromagnetic (EM) shielding capabilities, allowing them to serve as reliable grounding pads for handheld devices in need of enhanced conductivity and shielding performance.


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