RF Micro Devices Inc. announced the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD® RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD’s FEMs achieve industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest reference designs from the world’s leading WiFi chipset providers.

The WiFi market is growing rapidly, driven by increasing consumer demand for access to mobile broadband data and the expanding operator requirements for data offload to accommodate increased cellular and cable network services. By 2015, it is projected the WiFi FEM mobile/embedded and consumer premises equipment markets will exceed $1.8 billion.

Rohan Houlden, general manager of RFMD’s wireless connectivity business unit, said, “RFMD’s newest WiFi front end modules demonstrate industry-leading performance and are aligned with the industry’s leading WiFi chipset providers on their most anticipated reference designs. By achieving superior linearity and dynamic EVM, RFMD’s WiFi front end modules enable the proliferation of mobile broadband connectivity across an ever-expanding range of growth markets, including smartphones, tablets, notebooks, ultra-books, PCs, TV/video, e-readers, gaming, and automotive.”

Dynamic EVM is a critical design specification for high data rate WiFi systems. While competitor solutions have traditionally measured static EVM performance, RFMD’s FEMs achieve superior dynamic EVM to deliver best-in-class real-world WiFi system performance. This enables optimum data throughput at increased operator range, current savings through optimal transmit and receive speeds, and an enhanced user experience during video streaming, gaming, and other high data rate applications.

RFMD’s RFFM8200/8202 (2.5 GHz) and RFFM8500/8502 (5 GHz) FEMs integrate the power amplifier, LNA, and switch functionality into a single plastic QFN package. Designed for both “chip on board” and “system-in-package” (SiP) implementations, both product families deliver best-in-class linear output power while operating over a wide range of operating voltages. The highly integrated FEMs significantly reduce external component count outside the core WiFi chipset.


Samples and production quantities are available now through RFMD’s online store or through local RFMD sales channels.

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