White Papers

thinkRF

Persistent Spectrum Monitoring

This article will introduce the three trends driving the need for persistent spectrum monitoring before comparing the benefits of a proactive approach to traditional RF drive tests which are often reactive and capture only a brief snapshot of the wireless environment. It will conclude by highlighting some of the key features and performance requirements RF Engineers should consider when comparing RF receivers.


Read More
Remcom

XFdtd Analyzes Complex Beam Steering Antenna Arrays

Remcom’s XFdtd® Electromagnetic Simulation Software contains analysis tools for rapidly characterizing the performance of arrays of antennas for beamforming and beam steering applications. This whitepaper demonstrates how unique features like superposition and array optimization simplify the process for understanding device performance by providing efficient ways to validate array coverage.


Read More
Cadence

Advances in EM Analysis and Design Flows for RF System Development

RF/mixed signal PCB systems and heterogeneous SiP technologies are increasingly susceptible to delayed product development turnaround times due to higher frequencies and component densities. This paper overviews the Cadence design platforms that provide seamlessly integrated EM and multiphysics/thermal simulation with the capacity to solve large-scale design and integration problems across IC, package, and board.


Read More
Mini Circuits

Filtering Solutions for 5G C-Band Interference with Radar Altimeter Receivers

Recent debate about potential interference between 5G network equipment operating in C-band frequencies and radar altimeter (RA) receivers onboard commercial aircraft has highlighted the need for high-Q filtering solutions in crowded spectral environments. This paper presents two Mini-Circuits filters fabricated using ceramic resonator and cavity technologies designed specifically to eliminate interference by 5G C-Band emissions when incorporated either within or in line with the RA assembly.


Read More
Palomar

The Journey to Full-Scale Semiconductor Packaging

The journey from concept to full-scale semiconductor packaging is often hindered by a number of different obstacles along the way including everything from diverse teams scattered across the world to simply not understanding how the manufacturing process of die bonding, wire bonding or vacuum reflow impacts the package design and vice versa.


Read More
Rohde and Schwarz

NewSpace Gateway and User Terminal Testing Challenges

Satellite communication systems combine features from cellular networks and wireless technologies. New constellations are under development that attempt to provide ubiquitous mobility and internet networks via satellites, ground stations and user terminals. Each link in the supply chain presents challenges for R&D, production and deployment for the components and system development.


Read More