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Articles Tagged with ''conference''

ARMMS reaches out to encourage youth

April 30, 2012

At the 2012 April ARMMS RF & Microwave Society Meeting, held near Oxford, UK, Robert Smith of Cardiff University and Stephen Russell of Glasgow University both received newly introduced Young Engineer Prizes, intended to recognise and encourage engineers beginning their career in RF & Microwave technology.


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RFMD to present at the Barclays Capital Global Technology, Media and Telecommunications Conference

May 15, 2012

RF Micro Devices, Inc. announced that company executives are scheduled to present at the 2012 Barclays Capital Global Technology, Media And Telecommunications Conference in New York, NY on Tuesday, May 22, 2012, at 10:15 a.m. Eastern Time.


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Horizon House announces new conference in China - EDI CON 2013

May 22, 2012

EDI CONHorizon House has announced plans to launch the inaugural Electronic Design Innovation Conference (EDI CON 2013) in Beijing, China in March 2013 that will focus on design concepts and techniques of RF, microwave and high-speed digital components and systems in China


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RFMD to present at the Stephens Inc. Spring Investment Conference

May 30, 2012

RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced that company executives are scheduled to present at the 2012 Stephens Inc. Spring Investment Conference in New York, NY on Wednesday, June 6, 2012, at 9:00 a.m. Eastern Time.


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Plextek reveals low cost amplifier integrated circuit at IMS2012

June 8, 2012

Plextek (www.plextek.com), a leading designer of custom ICs operating at microwave and mm-wave frequencies, will be presenting details of a low cost, SMT packaged, 6 to 18GHz, 0.5W amplifier integrated circuit (IC) at the International Microwave Symposium, the world’s largest microwave conference and exhibition.


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Rogers to highlight material solutions spanning RF to digital at the 2012 IPC Midwest Show

August 8, 2012

Rogers Corp. will have a strong presence at the upcoming IPC Midwest Exhibition and Conference, both on the show floor and as part of the technical conference. This key industry event is scheduled for August 22-23 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL, the IPC Midwest Exhibition and Conference (www.ipcmidwestshow.org) is for electronic circuit assembly and printed-circuit-board (PCB) manufacturing professionals.


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Lake Shore Cryotronics to speak on rugged THz photomixer package at IRMMW-THz

August 21, 2012
p> Lake Shore Cryotronics Inc., a manufacturer of scientific sensors, instruments, and systems for precise measurement and control, announces that it will be speaking about a rugged terahertz (THz) photomixer package specifically developed for cryogenic operation, at the International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz). The conference will be held Sept. 23-28, 2012, in Wollongong, Australia.


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Strand CEO to speak at Exhibit Source Conference

September 10, 2012

Strand Marketing, an award-winning business-to-business marketing and advertising agency, has announced that David Strand, CEO and brand director of Strand, will be a guest speaker at The Exhibit Source’s “Source Conference” on technology trends in trade show marketing on Thursday, September 13, 2012 at 2:00 PM. The event will be held in the newly remodeled Exhibit Source Showroom, 145 Wells Avenue, Newton MA.


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Rogers welcomes PCB West 2012 visitors with product news and design/manufacturing guidance

September 13, 2012

Rogers Corp. will be participating in the PCB West 2012 Conference & Exhibition in both the technical program and the exhibition floor. The PCB West 2012 Conference & Exhibition (www.pcbwest.com) features a three-day technical conference (September 25-27) and one-day exhibition hall (September 26). Rogers Corporation (www.rogerscorp.com) welcomes visitors to join them for the PCB West 2012 Conference & Exhibition to learn more about the practical use of its high performance PCB materials.


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Laird Technologies to attend SAE Convergence Conference & Exhibition

October 5, 2012

Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced it will attend the SAE Convergence Conference and Exhibition. The event will take place at the Cobo Center in Detroit, Michigan, October 16-17, 2012. Laird Technologies will exhibit at booth #919.


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