Skyworks Solutions Inc. has launched a breakthrough front-end system that integrates all RF and analog content between the transceiver and antenna for simplified design within demanding next generation mobile platforms.
AWR Corp. announced that agendas for the AWR Design Forums (ADF) 2012 (www.awrdesignforum.com) for Japan, Korea and Taiwan have been finalized and posted online, and registration will be open through the day preceding each event.
Agilent Technologies Inc. announced that its long-term relationship with AMCAD Engineering has been extended to include a technology partnership for services related to nonlinear design and measurement of new electronic devices.
Anritsu Co. announces its VectorStar ME7838A broadband VNA platform now has 4-port measurement capability, bringing the inherent advantages of the VectorStar platform to 4-port and differential mm-wave component development.
Empower is pleased to be releasing the first models of its “Size Matters” high power PA product family. Packaged in a 5U, air cooled chassis and delivering over 1 kW of output power in the frequency ranges of 20 to 500 MHz, 500 to 1000 MHz, and 20 to 1000 MHz, these first units offer unrivaled size/power advantages. Specs are guaranteed across full bandwidth and over temperature.
Agilent Technologies Inc. unveiled new technologies and breakthroughs for RF power amplifier design. These capabilities and more will be part of the next major release of Agilent’s flagship Advanced Design System.
Richardson RFPD Inc. announces its attendance and participation at the 2012 IEEE International Microwave Symposium (IMS). IMS, along with the RFIC symposium and the ARFTG conference, is part of Microwave Week, the largest gathering of radio frequency (RF) and microwave professionals, and the most important forum for the latest and most advanced research in these fields.
Cadence Design Systems, Inc. and Samsung Electronics have collaborated to deliver a 20 nanometer design methodology that incorporates double patterning technology for joint customer deployment and internal test chips. The collaboration brings new process advances for mobile consumer electronics, enabling design at 20 nm and future process nodes.