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Articles Tagged with ''design''

Agilent debuts breakthroughs in PA design for next release of ADS

Agilent Technologies Inc., Santa Clara, CA
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Agilent Technologies Inc. unveiled new technologies and breakthroughs for RF power amplifier design. These capabilities and more will be part of the next major release of Agilent’s flagship Advanced Design System.


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Agilent's newest 3D-EM software release increases integration with circuit design flow

Agilent Technologies Inc., Santa Clara, CA
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Richardson RFPD to exhibit at IMS 2012

Richardson RFPD Inc.
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Richardson RFPD Inc. announces its attendance and participation at the 2012 IEEE International Microwave Symposium (IMS). IMS, along with the RFIC symposium and the ARFTG conference, is part of Microwave Week, the largest gathering of radio frequency (RF) and microwave professionals, and the most important forum for the latest and most advanced research in these fields.


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Samsung and Cadence deliver 20 nm digital design methodology

Cadence Design Systems Inc.
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Cadence Design Systems, Inc. and Samsung Electronics have collaborated to deliver a 20 nanometer design methodology that incorporates double patterning technology for joint customer deployment and internal test chips. The collaboration brings new process advances for mobile consumer electronics, enabling design at 20 nm and future process nodes.


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Agilent accelerates early wireless design verification with new SystemVue release

Agilent Technologies Inc., Santa Clara, CA
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Agilent Technologies Inc. announced a new release of SystemVue, Agilent’s premier platform for designing communications systems.


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Agilent's newest GoldenGate software release accelerates design verification

EDAFocus
Agilent Technologies Inc., Santa Clara, CA
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Agilent GoldenGate, Reproduced with Permission, Courtesy of Agilent Technologies Inc.Agilent Technologies Inc. announced the latest release of its RFIC simulation, verification and analysis software, GoldenGate 2012.


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AWR highlights software demos at IMS 2012

AWR Corp.
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Visit AWR at the Booth #1514 to see Analyst™ - 3D EM technology for bumps, bond wires, tapered vias and more - and the latest release of Microwave Office™, Visual System Simulator™, AXIEM® and Analog Office® for MMIC, RFIC, RF PCB and module design.


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AWR Design Forum adds Taiwan to 2012 schedule

AWR Corp.
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AWR Corp. announces that it has added Taiwan to the list of cities scheduled for the July 2012 tour of the AWR Design Forum (ADF) 2012. The Taiwan event will take place on Thursday, July 12. 


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RFMD to present at the Stephens Inc. Spring Investment Conference

RF Micro Devices Inc.
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RF Micro Devices, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced that company executives are scheduled to present at the 2012 Stephens Inc. Spring Investment Conference in New York, NY on Wednesday, June 6, 2012, at 9:00 a.m. Eastern Time.


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MAGUS (PTY), EMSS and CST launch Antenna Magus version 4.0

EDAFocus
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Antenna Magnus 4.0MAGUS Ltd, EMSS Ltd., and CST AG, announced the version 4.0 release of Antenna Magus. It has crossed the 200 antenna mark, giving rise to the claims that it is the world’s leading antenna design tool.


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