Articles Tagged with ''design''

Dr. Qin Shen-Schultz, principal engineer at Auriga Microwave, will present two technical papers at this year's Electronic Design Innovation Conference (EDI CON).

Agilent Technologies Inc. announced a powerful new version of the Agilent EEsof EDA Advanced Design System software, ADS 2014. It is designed to dramatically improve design productivity and efficiency with new technologies.

The European RF and microwave industry is demonstrating its support for EDI CON 2014 at every opportunity, from the conference sessions, workshop presentations and the showcasing of the latest innovations on the show floor.

Agilent Technologies Inc. announced it will show its newest wireless design and test solutions that address present and future test technology challenges in  LTE, LTE-A, and 3GPP, Releases 11 and 12, at Mobile World Congress, Feb. 24-27, Barcelona, Spain.

AWR Corp. has released a new customer success story that demonstrates how the AWR Graduate Gift Initiative played a role in helping Dr. Dominic FitzPatrick found PoweRFul Microwave.

Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new 0.2 to 1.0 GHz, N-connectorized low noise amplifier (LNA) from Wavelex.

Agilent Technologies Inc. announced that Nitronex, a GaAs labs company and leading producer of GaN-on-silicon RF power devices, has selected Agilent to provide a complete GaN design flow that spans both device modeling and circuit simulation. The flow uses Agilent EEsof EDA’s IC-CAP model extraction software and Advanced Design System (ADS) circuit and system simulator—both market-leading platforms in RF and microwave design.

LPKF Laser & Electronics has announced it will exhibit at the Satellite 2014 exhibition, which takes place March 11-13 at the Walter E. Washington Convention Center in Washington, D.C. LPKF provides in-house rapid PCB prototyping systems for a variety of applications and will demonstrate its best-selling system, the ProtoMat S63, in booth 8120.

The Molex SpeedStack™ mezzanine connector system provides a low profile solution for PCB space savings and a narrow body width for optimized airflow in high-speed and very dense applications.  Compact SpeedStack connectors feature a stack height of 4.00mm and support data rates up to 40 Gbps per differential pair.  SpeedStack connectors will be displayed at Molex booth 117, DesignCon 2014.