advertisment Advertisement
advertisment Advertisement
advertisment Advertisement
advertisment Advertisement

Articles Tagged with ''design''

China Mobile Market, MWs in Space and the State-of-Communication ICs in China - topics in EDI CON keynotes

EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design organized by Microwave Journal and Horizon House has announced its line-up of speakers for the opening plenary session to be held on March 12th at the Beijing International Convention Center.


Read More

Joseph DiBiase joins AR as applications engineer

AR RF/Microwave Instrumentation has announced the addition of Joseph DiBiase to its staff of application engineers. DiBiase will assist AR customers and provide support to various AR engineering groups.


Read More

Agilent commits $90 M gift of software to Georgia Tech laboratory

Agilent Technologies Inc. announced the largest in-kind software donation ever in its longstanding relationship with the Georgia Institute of Technology.


Read More

Agilent to demo new solutions enabling tests from prototype validation to inline high-volume manufacturing at IPC APEX

Agilent Technologies Inc. will demonstrate its latest boundary scan analyzer, plus inline in-circuit and functional test systems at the IPC APEX EXPO, Feb. 19-21, at the San Diego Convention Center (Booth 2827) in San Diego, Calif.


Read More

Mentor Graphics announces new HyperLynx technology

Software/EDA Channel

Mentor Graphics announced the new release of its HyperLynx® product featuring advanced 3D channel and trace modeling, improved DDR signoff verification, and accelerated simulation performance.


Read More

Photo Stencil to present two papers at IPC APEX 2013

Photo Stencil LLC, a leading full-service provider of high-performance stencils and tooling, will present the papers, Printing and Assembly Challenges for QFN Devices and Two Print Stencils Process at IPC APEX 2013. Videos of the presenters describing these papers can be found at www.photostencil.com/apex2013.php.


Read More

Molex vertical connectors operate at SAS-3 and projected SAS-4 high-speed BWs

Molex Inc. introduces high density iPass+™ zHD vertical connectors for midplane or other non-edge-board applications. The new iPass+ zHD vertical connector system provides a 0.75vmm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidths.


Read More

DesignCon announces 2013 DesignVision Award winners

UBM Tech, whose portfolio includes essential business and technical information for design engineers and the electronics industry, announced the 2013 DesignVision Award winners, including industry firms Mentor Graphics, TE Connectivity, ANSYS Inc., Upverter, MicroSemi, Teledyne LeCroy and Averna.


Read More

AWR and Zuken announce RF verification flow for PCB design

AWR Corp.and Zuken announce AWR Connected for Zuken™. This RF printed circuit board (PCB) verification flow simplifies the PCB design process and therefore shortens design cycles by enabling users to quickly and easily simulate and verify embedded RF functionality.


Read More

Plextek rebrands for innovation and growth

Plextek Ltd. has announced a restructuring of its business to separate the consultancy from several lines of business including Plextek RF Integration, Telensa, Blighter and Redtail Telematics.


Read More

Sign-In

Forgot your password?

No Account? Sign Up!

Get access to premium content and e-newsletters by registering on the web site.  You can also subscribe to Microwave Journal magazine.

Sign-Up

advertisment Advertisement