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Articles Tagged with ''design''
An automated simulation-based design cycle has become a fundamental part of the success of one of today's leading designers of travelling wave tube (TWT) microwave amplifiers.
AWR announces the release of two new university success stories that reveal how students use AWR software to design novel and award-winning microwave/RF products.
What: AWR is offering an array of software demonstrations, lectures, and partner presentations at the Microwave Workshops and Exhibition 2012 (MWE2012) in Yokohama, Japan from November 28 through November 30.
Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announced that it has introduced a new addition to the CompactLine® series of microwave antennas with the release of the 6 GHz Category A SB6-W60B. Featuring a wind-tunnel tested design suited for both tight urban locations and rugged outposts, the SB6-W60B offers a superior radiation pattern for consistent performance with less interference.
eesy-ic has opened a new design center in Nuremberg, Germany. The company specializes in customized integrated circuit (ICs) development as well as application specific ICs with analog focus.
Agilent Technologies Inc. announced shipment of its GoldenGate 2012.10 RFIC simulation, verification and analysis software.
What: The new application note, “Concepts and Measurements of HSPA+ Evolution” explains what’s new in HSPA+, technical details and operations, new requirements for HSPA+ 3GPP Release 7 & 8, new design and test products for HSPA+, including manufacturing test.
IQD has extended the performance of their IQOV-90 series high stability low phase noise OCXOs to encompass the full standard industrial temperature range of -40 to 85°C. High operating temperature ranges are significantly more technically challenging in OCXOs than for other frequency products. By increasing the internal crystals turnover point to a safe margin above 85°C and reducing the thermal loss of the circuit, our design team have been able to increase the maximum external temperature range of the part to 85°C.
Recognized throughout the semiconductor and electronic design industries as the premiere annual trade event, DesignCon 2013 is scheduled for January 28-31 in Santa Clara, Calif. Hosted by UBM Electronics, the daily source of essential business and technical information for the electronics industry’s decision makers, the 14-track technical DesignCon conference program will include more than 100 in-depth tutorials, technical paper sessions and panel discussions.
API Technologies Corp., a trusted provider of RF/microwave, microelectronics, and security solutions for critical and high-reliability applications, announces an expanded magnetic product family and increased custom design and manufacturing capabilities. Since acquiring three well known magnetic entities, API has combined the people, products and technologies into a single division. The API Magnetics group now produces a broader range of magnetic devices, including transformers, inductors, chokes and coils as well as custom application-specific solutions.