Molex Inc. introduces high density iPass+™ zHD vertical connectors for midplane or other non-edge-board applications. The new iPass+ zHD vertical connector system provides a 0.75vmm pitch vertical connector that meets requirements of SAS-3 and projected SAS-4 bandwidths.
UBM Tech, whose portfolio includes essential business and technical information for design engineers and the electronics industry, announced the 2013 DesignVision Award winners, including industry firms Mentor Graphics, TE Connectivity, ANSYS Inc., Upverter, MicroSemi, Teledyne LeCroy and Averna.
AWR Corp.and Zuken announce AWR Connected for Zuken™. This RF printed circuit board (PCB) verification flow simplifies the PCB design process and therefore shortens design cycles by enabling users to quickly and easily simulate and verify embedded RF functionality.
CST is pleased to announce that the Optenni Lab™ matching circuit optimization software is now available through the global CST sales channels. Optenni Lab will be fully supported by the CST sales and technical support teams distributors worldwide.
AWR Corp., the innovation leader in high-frequency EDA software, today announces RFP™, an innovative new frequency planning wizard within Visual System Simulator™ (VSS) that enables engineers to effortlessly and efficiently determine spurious free bandwidths when designing complex radio communications systems.
AWR Corp. has announced AWR Design Environment V10.04, its first new software release in 2013, which includes many new features and enhancements to Microwave Office/Analog Office and Visual System Simulator, as well as AXIEM and Analyst.
Texas Instruments Inc. (TI) introduced a wideband frequency synthesizer with integrated voltage-controlled oscillator (VCO) that delivers the industry’s lowest phase noise. Its combination of ultra-low noise phase-locked loop (PLL) and industry’s highest phase detector frequency outperforms the competition in both phase noise and spurs.
CEA-Leti and Agilent Technologies will present their recent research results in the field of embedded integrated systems at the IEEE Silicon Monolithic Integrated Circuits in RF Systems (SiRF) Conference in Austin, TX, Jan. 21-23.