Articles Tagged with ''design''

TriQuint Semiconductor Inc., a leading RF solutions supplier and technology innovator, announced the appointment of Upstar Technology as its new distributor in China for TriQuint high-performance mobile products.

Visit National Instruments at booth 633 at IMS2014.

ETL Systems, a global designer and manufacturer of RF distribution equipment for satellite communications, has launched a new components mounting system (CMS) as part of its new line of RF equipment. 

 

MCV Microwave will be making a MicroApps presentation at IMS on Wednesday morning June 4 on "Ceramic Filter for 5 GHz Wireless Applications”.
 

Agilent Technologies Inc. announced that its EXM wireless test set now supports 4x4 True MIMO capability for WLAN design and validation, with up to four TRXs testing multiple-input, multiple-output antenna characteristics simultaneously. This capability further advances the gigabit era for WLAN evolution, especially the rapidly evolving 802.11ac technology.

This high resolution EMC/EMI diagnostic system has been reinvented to assist high density board designers to visualize the root causes of potential EMC and EMI problems during pre- and post-EMC compliance testing.

Anokiwave Inc., a supplier of semiconductors enabling mmW markets, announced the opening of its newest design center located in Billerica, MA to support the company's increasing demand for highly integrated SiGe core chips and GaAs/GaN front-end solutions.

 

If you had any doubts that Brooklyn was fast becoming one of the hottest locales in the tech industry, look no further than the 5G Summit, held from April 23 to 25 at the New York University Polytechnic School of Engineering. Co-organized by the NYU WIRELESS research center and Nokia Solutions and Networks (NSN), the conference, planned to be an annual event from now on, brought together industry leaders from across academia, business and government to explore the future of Fifth Generation—more commonly called 5G—wireless technology.

We have an exciting agenda of activities that provide insight into the powerful, innovative tools and technologies of our newly released V11 NI AWR Design Environment™, which includes Microwave Office®, Analog Office®, Visual System Simulator™ (VSS), AXIEM®, and Analyst™ for the design of MMICs, RF PCBs, microwave modules, RFICs, communication systems, radar systems, antennas, and more.

 

Molex Inc. will showcase its flexible microwave cable assemblies at the International Microwave Symposium, June 1 – 6, Tampa Bay, FL, Booth 508.  The assemblies replace stiff, semi-rigid assemblies with a combination of Temp-Flex® coaxial cables and high-performance radio frequency (RF) connectors.