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Articles Tagged with ''ribbon''
COMSOL Inc., a leading global provider of engineering simulation software, announced the release of COMSOL Multiphysics® 4.4, the latest version of its powerful platform for the modeling and simulation of electrical, mechanical, fluid, and chemical applications.
Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.
Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.
CST announces that shipping has begun for CST STUDIO SUITE® 2013, the latest version of their flagship product. CST STUDIO SUITE comprises a range of EM simulation tools, including the industry-leading high-frequency package CST MICROWAVE STUDIO®.
Computer Simulation Technology (CST) will be previewing CST STUDIO SUITE 2013 and its new design environment at EuMW 2012, booth #217. The increasingly complex tasks design engineers face today require a large number of sometimes specialised features. Simulation software vendors such as CST have enhanced their tools to accommodate these requirements.