Articles Tagged with ''ribbon''

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Computer Simulation Technology (CST) will be previewing CST STUDIO SUITE 2013 and its new design environment at EuMW 2012, booth #217. The increasingly complex tasks design engineers face today require a large number of sometimes specialised features. Simulation software vendors such as CST have enhanced their tools to accommodate these requirements.

CST announces that shipping has begun for CST STUDIO SUITE® 2013, the latest version of their flagship product. CST STUDIO SUITE comprises a range of EM simulation tools, including the industry-leading high-frequency package CST MICROWAVE STUDIO®. 

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.