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Articles Tagged with ''ribbon''

COMSOL Multiphysics 4.4 shines with a new COMSOL Desktop and tools

Software/EDA
November 27, 2013

COMSOL Inc., a leading global provider of engineering simulation software, announced the release of COMSOL Multiphysics® 4.4, the latest version of its powerful platform for the modeling and simulation of electrical, mechanical, fluid, and chemical applications.


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Hesse Mechatronics debuts dual-head wedge bonder in the Americas

June 6, 2013

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.


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Hesse launches heavy wire and ribbon bonding services for product development

May 6, 2013

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.


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CST STUDIO SUITE 2013 now shipping

Software/EDA
April 18, 2013

CST announces that shipping has begun for CST STUDIO SUITE® 2013, the latest version of their flagship product. CST STUDIO SUITE comprises a range of EM simulation tools, including the industry-leading high-frequency package CST MICROWAVE STUDIO®. 


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Usability and performance focus of CST STUDIO SUITE 2013

October 29, 2012

Computer Simulation Technology (CST) will be previewing CST STUDIO SUITE 2013 and its new design environment at EuMW 2012, booth #217. The increasingly complex tasks design engineers face today require a large number of sometimes specialised features. Simulation software vendors such as CST have enhanced their tools to accommodate these requirements.


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