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AWR Corp. announces the commercial release and immediate availability of Analyst. Analyst is a full featured, 3D EM industry standard FEM simulator that is completely integrated into AWR’s Microwave Office circuit simulation environment.
A new forecast predicts dramatic growth in the semiconductor market supporting small cells, from $90 million in 2012 to more than $650 million in 2017. In particular, semiconductors supporting carrier-grade small cells (excluding consumer and enterprise femtocells) will ramp from practically zero revenue in 2012 to a staggering $500 million in 2017.
What: Sherry Hess, VP of Marketing at AWR, has posted a new blog discussing the value of online videos as an innovative educational resource for providing remote learning. The blog, “Kahn Academy—I’m a Fan!” lauds the Kahn Academy website, which provides over 3,500 online videos on all facets of education. It compares this education model to AWR’s own AWR.TV online video channel, which is a valuable resource for customers, university students, and anyone interested in AWR’s RF/microwave design software.
AWR Corp., the innovation leader in high-frequency EDA software, will showcase in Booth #7 at IEEE Radio Wireless Week 2013 the latest version of its AWR Design Environment™ with many new features and enhancements specifically developed for high-frequency wireless design.
AWR Corp. has announced AWR Design Environment V10.04, its first new software release in 2013, which includes many new features and enhancements to Microwave Office/Analog Office and Visual System Simulator, as well as AXIEM and Analyst.
EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design organized by Microwave Journal and Horizon House has announced its line-up of speakers for the opening plenary session to be held on March 12th at the Beijing International Convention Center.
AWR's new application note, “Using Analyst™ To Quickly And Accurately Optimize A Chip-Module-Board Transition,” highlights the unique features of its’s 3D finite element method (FEM) EM simulator by demonstrating the optimization of the transition from a board-to-chip signal path.
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