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Articles Tagged with ''designers''

Sonnet introduces Blink, the first full-wave multi-solver suite for on-chip passive device modeling

Software/EDA
March 11, 2014

Sonnet Software Inc. introduces Blink™, the first multi-solver passive device modeling suite, now available for purchase. Blink operates entirely from within the Cadence® Virtuoso® environment and is used for the analysis of on-chip passive devices such as spiral inductors and MIM capacitors.


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Modelithics welcomes Syfer as MVP and announces new MW Global Model for 0603 high Q capacitors

January 29, 2014

Modelithics Inc. welcomed Syfer to the Modelithics Vendor Partner (MVP) Program. Syfer and Modelithics have collaborated to develop a Microwave Global Model™ for Syfer’s 0603 case-size High Q Ultra-Low ESR capacitor family. These simulation models are substrate scalable, part-value scalable, pad scalable, and orientation selectable (vertical or horizontal surface-mount).


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GoldenGate 2013.10 RFIC Software

Software/EDA
January 6, 2014

GG_(shared)-01Agilent Technologies Inc. announced the release of GoldenGate, its RFIC simulation, verification and analysis software. Agilent EEsof EDA’s GoldenGate 2013.10 provides RFIC designers with easy-to-use EVM-, BER- and ACPR-type measurements and enables them to quickly analyze and diagnose problem areas in large-signal analysis.


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DesignCon 2014 announces technical program and expo highlights

October 21, 2013

UBM Tech, the electronics industry’s daily source of essential business and technical information, released the DesignCon 2014 technical program. Created by engineers for engineers, DesignCon’s award-winning technical program provides attendees with four days of intensive technical learning and networking opportunities, enabling chip, board and systems designers, software developers and silicon manufacturers to expand their design expertise. DesignCon will be held January 28-31, 2014 in Santa Clara, CA. 


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AWR announces AWR Connected for AMPSA

October 8, 2013

AWR Corp., the innovation leader in high-frequency electronic design automation (EDA), and AMPSA, supplier of RF and microwave amplifier design software, announce AWR Connected™ for AMPSA, a synthesis-through-simulation design flow specifically developed to improve design throughput and productivity for amplifier designers.


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Auriga to showcase pulsed IV/RF characterization system and component test system at EuMW

October 1, 2013

Auriga Microwave is exhibiting at EuMW 2013, in booth #D104. On display will be Auriga's AU4850, a pulsed IV/RF characterization system, and its fourth generation component test system: CTS-4.


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Overcome signal integrity challenges in ultra-high speed (>2 GHz) PCB designs in real-time

Software/EDA
September 18, 2013

At very high frequencies, signal propagation and transmission line effects on PCBs tend to happen earlier and become prominent. PCBs may also exhibit multiple resonances and power decoupling becomes more challenging than ever before. To overcome these challenges, PCB Designers and Engineers can count on the new EMSCAN EHX to verify the impact of rerouting signals or modifying PCB layout or materials used on the PCBs.


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Modelithics COMPLETE Library v10.1 of simulation models now available for AWR's Microwave Office

June 3, 2013

AWR Corp., the innovation leader in high-frequency EDA software and Modelithics Inc., the industry leader in simulation models for RF, microwave, and millimeter-wave devices, announce the availability of Version 10.1 of the Modelithics COMPLETE Library of passive and active device models for AWR’s Microwave Office® high-frequency design software.


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Isola to exhibit at IMS 2013

May 30, 2013

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials, will exhibit at the upcoming International Microwave Symposium (IMS) 2013 to be held in conjunction with the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, and the ARFTG Microwave Measurement Conference. The exhibition takes place June 4-7, 2013 at the Washington State Convention Center located at 800 Convention Place in Seattle.


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Rogers launches high frequency laminate material with improved thermal reliability for higher MOTs

May 30, 2013

Rogers Corp. Advanced Circuit Materials Division launched next generation RO4360G2™ laminates with improved thermal reliability for higher UL MAXIMUM OPERATING TEMPERATURES (MOTs).


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