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Industry News / Materials/Packages

Rogers to Exhibit Power Electronic Solutions

February 19, 2010
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Two divisions of Rogers Corp. - Power Distribution Systems and Thermal Management Solutions – will be exhibiting at the upcoming Applied Power Electronics Conference (APEC) and Exposition (Booth # 235) in Palm Springs, CA, February 21-25.

Rogers Power Distribution Systems will be exhibiting its RO-LINX® custom designed busbars. Rogers will present its broad RO-LINX Busbars product family, including RO-LINX Performance, Ro-LINX Easy and RO-LINX Thermal. RO-LINX busbars serve as power distribution highways. Rogers laminated busbars enable high current density and power switching with minimal losses through the power module. Benefits include optimized inductance, compact design, reduction of installation time and the UL rating.

The Thermal Management Solutions Division will be showcasing its HEATWAVE™ high performance AISiC metal matrix composites (MMC) that combine excellent thermal conductivity and controlled thermal expansion with low density and high stiffness to match the performance characteristics of today’s most advanced power semiconductor device packaging solutions and systems.

Rogers HEATWAVE materials improve long-term reliability and thermal performance, and deliver ease of integration into semiconductor and high-power amplifier applications. With thermal conductivities from 170 to 230W/m/K, they provide the widest possible range of tailored coefficient of thermal expansion (CTE) performance.


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