HIRAI LTCC foundry service provides its featured 2D/3D hybrid fabrication technology for high Q multi-layered substrates of micro- and millimeter-wave applications. Exhibited are the millimeter-wave module that integrates a slot array antenna, a hollow layer underneath, a post-wall waveguide and an aperture coupled waveguide-to-microstrip line transition, presently under development with the Tokyo Institute of Technology, Japan, as well as a novel BPF of which sampling could be available soon.