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ARTICLES

HIRAI Features 2D/3D Hybrid Fabrication Technology

June 3, 2009
HIRAI LTCC foundry service provides its featured 2D/3D hybrid fabrication technology for high Q multi-layered substrates of micro- and millimeter-wave applications. Exhibited are the millimeter-wave module that integrates a slot array antenna, a hollow layer underneath, a post-wall waveguide and an aperture coupled waveguide-to-microstrip line transition, presently under development...
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