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Industry News / Materials/Packages

Rogers to Feature Advanced Circuit Material and Thermal Management Solutions

January 22, 2009
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Rogers Corp.'s Advanced Circuit Materials Division (ACMD) and its newly formed Thermal Management Solutions (TMS) Division will be exhibiting RO4000®, RO2808® and ULTRALAM® 3000 advanced high frequency laminates along with HEATWAVE™ and COOLSPAN™ thermal management products at the upcoming DesignCon 2009 show to be held at the Santa Clara, CA Convention Center, February 3-4 (Rogers booth # 814).

RO4000, RO2808 and ULTRALAM 3000 laminates provide proven solutions for a wide range of applications such as high speed network transport gear, high performance chip carrier substrate and high speed data transmission used in high speed computing, telecommunications and wireless.

Design engineers will be particularly interested in RO2808 high frequency material, a new offering from Rogers. A ceramic-filled PTFE material with a dielectric constant of 7.6, RO2808 offers the stability and high frequency performance of LTCC. RO2808 boasts a low loss tangent of 0.002 or less, and can be supplied as 1-mil thick boards to support low profile designs. It also features high moisture resistance, high reliability and excellent high frequency performance.

RO4000 is a widely used laminate in the power amplifier market, with outstanding electrical and mechanical properties. A low loss material, RO4000 exhibits low z-axis expansion, making it an ideal choice for high frequency applications subject to wide temperature extremes.

RogersULTRALAM 3000 Series LCP circuit material is a thin double-clad copper laminate, characterized by low and stable dielectric constant (2.9) and dielectric loss. It has very low moisture absorption (< 0.04 percent by weight). ULTRALAM 3000 Series laminates are used for high frequency microminiaturization applications, sensors, antennas and high speed flip-chip designs. ULTRALAM 3000 can be used with ULTRALAM 3908 bonding film for multilayer constructions.

RogersHEATWAVE products are high performance AISiC Metal Matrix Composite materials that combine lightweight and thermal expansion control with excellent thermal conductivity. Applications include power conversion and control, RF power amplifiers and semiconductor package lids.

Thermal Interface Material (TIM) includes COOLSPAN 355 and 340 thermal grease used in high performance and high reliability chip packaging applications where heat management becomes a limiting factor. Rogers' COOLSPAN TIM can be used in both TIM-1 and TIM-2 applications. These products feature excellent thermal conductivity, low interfacial thermal resistance and have superior re-work properties compared with silicone-based products.

RogersCOOLSPAN 500 ETCA (Electrically & Thermally Conductive Adhesive), unsupported silver-filled B-staged epoxy adhesive film for use in microwave circuit and heatsink applications where an electrical ground path is desired. Other applications include die attach, printed circuit board fabrication and advanced material composites.


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