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EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.
PLENARY SESSION PRESENTATIONS
Keynote talks from Honorary Chair, Dr. Professor Song Junde of BUPT, Guy Sene, President of EMG, Agilent Technologies (Platinum Sponsor), Guang Yang, Senior Mobile Communications Analyst, Strategy Analytics, Bertrum Arbesser-Rastburg, Head ESA-ESTEC, Dr. Guangyi Liu, senior Researcher, China Mobile Research Institute, Deng Jie, General Manager, ZTE Microwave Products Group and Feng Keming, General Director Beijing Insttitute of Radio Metrology and Measurement.
The peer-reviewed technical paper sessions offer three tracks addressing:
Invited and submitted papers are reviewed by the EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of EM, circuit and system simulation, test verification, RFIC, MMIC and high-speed semiconductors, passive components, and system integration. In addition, the morning technical program will have a fourth track on commercial resources featuring sponsored papers.
Download current conference schedule
Workshops provide a forum for industry practitioners to share information on specific challenging and emerging topics related to high-frequency/high-speed electronic design. Workshop sponsors are responsible for developing the content according to the guidelines set by the EDI CON organizers. Workshops are an interactive experience, allowing extra time for audience questions and participation, which may include demonstrations and opportunities to work with design software and/or measurement equipment.
Workshops in development include: TD-LTE • 802.11ac • Carrier Aggregation • NFC • High-Speed Data Converters • FPGAs for Wireless Communications • RFICs • Front-ends • SATCOM • Radar Systems • EMC/EMI
Forums feature presentations from a panel of experts followed by a joint question and answer session with audience members. Each 60 minute session will include three panelists, recognized for their expertise in their respective fields. Each panelist will give a 15 minute presentation on the challenges and potential solutions impacting a specific technology or application followed by a question and answer session. The conference organizers and individual panel sponsors are responsible for coordinating the panel topic and invited speakers.
Current scheduled forums include:
To sponsor a panel, contact your local Microwave Journal or Microwave Journal China representative
EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other shows with a separate more academic focused conference, EDI CON has industrial and technology leaders delivering most of the technical sessions, workshops and panels so that the exhibition is closely coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.
By David Vye, Microwave Journal Editor
A look into the upcoming EDI CON show that will take place in Beijing, China on March 12-14, including a sneek peek into the conference program and workshops.
By Guy Sene, Agilent Technologies
Discusses how design innovation will be critical to China's ongoing industrial and economic development, and how EDI CON 2013 will provide the solutions and technology necessary to encourage design and development.
EDI CON 2013 News
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