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Molex, a global electronics leader and connectivity innovator, announces a significant expansion of its award-winning AirBorn SInergy Modular High-Speed Hybrid Connectors.

CommScope to reveal new design at the Computex 2026 show; FastSelfClean technology represents a new approach to reducing loss in data centers’ fiber networks.

Integra Technologies announced the industry’s first single High Voltage GaN on Silicon Carbide (HV GaN/SiC) 150 V transistor.

The new "Sequence Restart Mode" expands the long list of functions, firmware options and software tools to make the AWGs even more versatile. Driven by direct customer demand, Spectrum quickly developed and delivered the new feature as a support task, and provides it now to all customers free of charge

Microsembly specializes in RF and microwave microelectronics assembly, device evaluation, advanced SMT manufacturing, integrated microwave module production, and environmental qualification for aerospace, defense, satellite communications, telecommunications, medical, industrial, and research markets.

Amazon.com, Inc. and Globalstar, Inc. announced that they have entered into a definitive merger agreement under which Amazon will acquire Globalstar, enabling Amazon Leo to add direct-to-device (D2D) services to its low Earth orbit satellite network and extend cellular coverage to customers beyond the reach of terrestrial networks. 

Groundbreaking research is underway at Northrop Grumman’s Microelectronics Center (NGMC) which is reshaping physicists’ understanding of diamonds, positioning them as the next-generation material used in manufacturing microelectronics.