Industry News

ARTICLES

EuMW2020 Virtual Event

EuMW Announces Virtual Event for EuMW 2020

EuMW selects vFairs advanced graphical platform to enable networking, learning, and exhibition in lieu of in-person event this year

In light of the global pandemic, growing numbers of cases in Europe, and related measures imposed by the respective authorities, European Microwave Week (EuMW) organizers have decided to make EuMW 2020 a virtual event this year while simultaneously planning for the next in-person event in London in October of 2021.


Read More
Ifixit

iPhone 12/12 Pro Teardown for RF

Qualcomm and Skyworks are the big winners

As soon as the iPhone 12/12 Pro were released, IFIXIT did a live video of the teardown to see which chips and components made it into the US version phone. Find out which RF modules that were identified in the teardown.


Read More
Qorvo GaN device

GaN and GaAs: 5G Brings Thriving Business Opportunities

Following the deployment of higher frequencies in sub-6 GHz 5G bands, GaN demonstrated properties that exceed the existing Silicon based LMDOS technology in terms of higher bandwidth and higher power density requirements. With the emerging market opportunities, the following questions are being raised in the industry: What is the business outlook for the GaN RF market with the arrival of 5G? Which technology, GaN-on-Silicon Carbide (SiC) or GaN-on-Silicon, will more successfully grow its market? Which business models will dominate in the market? How will the GaN RF business evolve in view of the US-China tension, which is becoming more sensitive than ever?


Read More
Qualcomm infrastructure

Qualcomm Introduces New 5G Infrastructure Platforms to Drive Cellular Ecosystem Transition to vRAN

New Portfolio of Qualcomm® 5G RAN Platforms is Designed to Enable a New Generation of Flexible, Virtualized & Interoperable Cellular Networks

Qualcomm Technologies, Inc. today announced a full portfolio of 5G infrastructure semiconductor platforms designed for broad deployment scenarios, ranging from macro base stations with massive MIMO to micro base stations with compact designs, to accelerate the cellular ecosystem transition toward virtualized and interoperable radio access networks (RAN)


Read More
OpenRF

Leading Wireless Chipset Providers Launch OpenRF to Advance RF Front End Development and Drive Interoperability

OpenRF delivers optimum system performance, greater choice in RF front end platforms, faster time-to-market, and lower Total Cost of Ownership for 5G device manufacturers

The Open RF Association (OpenRF™) today announced its formation as an industry consortium dedicated to expanding the functional interoperability of hardware and software across multi-mode RF front end and chipset platforms into the 5G era, responding to customer demand for open architectures. Its founding members include Broadcom Inc., Intel Corporation, MediaTek Inc., Murata Manufacturing Co., Ltd., Qorvo, and Samsung.


Read More
See More Videos