Items Tagged with 'Teledyne e2v'

Teledyne e2v Semiconductors announced the successful initial qualification of its 16 GB Space DDR4 memory, marking a key milestone in the advancement of high-reliability memory solutions for space-grade applications.

Teledyne e2v announced the immediate availability of Engineering Models for its new 16 GB radiation-tolerant DDR4 memory.

Teledyne e2v announced engineering models of the LX2160-Space 16-core Arm® Cortex® A72 based system on chip (SoC) processor, enabling early project design, hardware and software validation for space-demanding applications.

Teledyne e2v announced engineering models of the LX2160-Space 16-core Arm® Cortex® A72 based SoC processor.

Teledyne e2v announces that the company has qualified and released an upscreened version of the LX2160 to operate between -55°C to +125°C. 

Teledyne e2v announced the successful apace qualification of its 8 GB space DDR4 memory as part of its edge compute solutions for space. 

Teledyne e2v HiRel Electronics announced the availability of its rad-tolerant, L- and S-Band, low noise amplifier, model TDLNA002093SEP. 

Infineon Technologies and Teledyne e2v have developed a reference design for the implementation of compute-intensive space systems.

Teledyne e2v announced the introduction of an 8 GB Space DDR4 memory as part of its edge computing solutions for space. 

Teledyne e2v previewed the future availability of its EV10AS940 the latest advanced 10-bit broadband data converter.