Items Tagged with 'roadmap'

SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) announced that they have won a $300,000 grant from the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) to produce a roadmap for advancing heterogeneous integration and advanced packaging technologies in the U.S.  

CEA, Soitec, GlobalFoundries and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry’s next-generation roadmap for FD-SOI technology.

AT&T is unveiling its 5G roadmap to bring customers the next-generation of super-fast, flexible wireless connectivity.