Items Tagged with 'expansion'

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Linear Technology expands in Singapore to boost worldwide production capacity

Linear Technology Corp. opened the company’s third semiconductor test facility in Singapore. The additional space for staff, equipment and materials will allow the company to more than double its production capacity of advanced analog circuits and µModule® (micromodule) products. This will strengthen Linear Technology’s ability to meet the growing demand for high performance analog integrated circuits worldwide.


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COMSOL expands in Shanghai to support growth of multiphysics and simulation software

COMSOL, the leading provider of multiphysics modeling, simulation, and application design software, today announced the expansion of its office in Shanghai, China. A larger facility enables continued expansion and recruitment of technical and sales staff to keep pace with the growing COMSOL® software user base in China and increasing demand for COMSOL Multiphysics® and COMSOL Server™ products.


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Spectrum announces expansion in the U.S.

Spectrum is pleased to announce that it is boosting its sales and support services in the U.S. with the opening of Spectrum Instrumentation Corp. Spectrum, headquartered in Grosshansdorf, Germany, is a pioneer in design and manufacturing of PC based test and measurement instrumentation that is used for electronic signal capture, generation and analysis. The company specializes in high-speed digitizer and generator technology and has available over 400 modular products in the popular industry standards; PCIe, LXI and PXI.


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RFMD expands assembly capacity to accommodate strong product demand

RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, announced it has successfully completed a recently announced expansion of its test, tape and reel, and assembly facility, located in Beijing, China. In addition to newly qualified internal assembly capacity for power amplifiers (PA), switch-based products, and antenna control solutions, RFMD is also qualifying advanced flip chip capabilities for its 2G, 3G, and 4G LTE and TD-LTE products.


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