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u-blox has announced u-blox IRIS-W1, the first compact stand-alone Wi-Fi module combining dual-band Wi-Fi 6, Bluetooth® LE 5.3 and Thread including support for Matter.
Murata launched its newest Bluetooth® LE module, the Type 2EG. Based on the RSL15 secure Bluetooth 5.2 MCU from onsemi, the product delivers a fully certified, secured, ultra-small Bluetooth LE solution.
Renesas Electronics Corporation announced its first development kit that includes support for the new Matter protocol and Matter support on all future Wi-Fi, Bluetooth Low-Energy and IEEE 802.15.4 (Thread) products.
The Bluetooth Special Interest Group (SIG) announced a new specification development project to define the operation of Bluetooth LE in additional unlicensed mid-band spectrum, including the 6 GHz frequency band.
Renesas Electronics Corporation announced the development of two 2.4 GHz RF transceiver technologies that support the Bluetooth® LE low-power, near-field communication standard.
Infineon Technologies AG is launching the AIROC™ CYW20829 Bluetooth® LE SoC, a Bluetooth 5.3 core spec-compliant device for IoT, smart home and industrial applications.
