Items Tagged with 'planar'

POET Technologies Inc. – developer of the planar opto-electronic technology (“POET”) platform for monolithic fabrication of integrated circuit devices containing both electronic and optical elements on a single semiconductor wafer – is extremely pleased to announce the appointment of Dr. Suresh Venkatesan as CEO of the company.

Nuhertz Technologies is pleased to introduce FilterSolutions 2015 edition as Version 14 at IMS2015 in Phoenix, Ariz.

POET Technologies Inc., developer of the planar opto-electronic technology platform for monolithic fabrication of integrated circuit devices containing both electronic and optical elements on a single semiconductor wafer – is extremely pleased to announce that that the board of directors has appointed two new directors.

TEGAM Inc., a leading supplier of innovative RF power measurements, was recently awarded Patent No. 8,558,556, “Planar-axial thermistor for bolometry.” This patent describes a novel way to construct very small planar thermistors on a substrate with very low heat transfer. The thermistors are more thermally isolated from the environment than are commercially-produced thermistors. Both the small size and thermal isolation make them useful for measuring RF power at microwave frequencies up to 70 GHz.

Planar Monolithics Industries Inc. (PMI) has announced that effective April 30 2013, PMI acquired100% of all the assets & property of Hari LLC. 

International Manufacturing Services Inc. (IMS), a manufacturer of high quality thick film resistors, terminations, attenuators, couplers, thermal management devices, planar dividers and planar filters to the electronics industry, has introduced a new type of chip resistor terminal which are non-magnetic and ultra leach resistant.

International Manufacturing Services Inc. (IMS) introduces its line of HVI Series chip resistors especially suited for high voltage applications.

Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The CopperVia was first introduced at the June2012 IEEE MTT-S International Microwave Symposium/Exhibition inMontreal, Quebec, Canada.

AWR Corp., the innovation leader in high-frequency EDA, and Magus (Pty) Ltd, developers of the leading antenna synthesis product Antenna Magus, announce Antenna Magus Version 4.1, which adds four new antenna types:

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.