Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities includesolid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.
NuSil Technology LLC (http://www.nusil.com), a formulator and manufacturer of silicone compounds for the aerospace, aircraft, electronics and photonics industries, announces the release of CV-2681-12, an electrically conductive, controlled volatility (low outgassing) film adhesive designed for a wide range of applications, from tacking down wires to working with solar cells and mirrors.
Visit AWR at the Booth #1514 to see Analyst™ - 3D EM technology for bumps, bond wires, tapered vias and more - and the latest release of Microwave Office™, Visual System Simulator™, AXIEM® and Analog Office® for MMIC, RFIC, RF PCB and module design.