Pat Hindle, MWJ Editor
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Pat Hindle is responsible for editorial content, article review and special industry reporting for Microwave Journal magazine and its web site in addition to social media and special digital projects. Prior to joining the Journal, Mr. Hindle held various technical and marketing positions throughout New England, including Marketing Communications Manager at M/A-COM (Tyco Electronics), Product/QA Manager at Alpha Industries (Skyworks), Program Manager at Raytheon and Project Manager/Quality Engineer at MIT. Mr. Hindle graduated from Northeastern University - Graduate School of Business Administration and holds a BS degree from Cornell University in Materials Science Engineering.

Wireless Connectivity ICs to Surpass $8 Billion in 2011

November 17, 2011

ABI Research recently reported that the total market for standards-based wireless connectivity ICs is expected to exceed 3.5 billion units per annum in 2011. “Broadcom leads the market with Qualcomm, CSR, and Texas Instruments all snapping at its heels,” says Peter Cooney, practice director, semiconductors. The market will total more than $11 billion per annum by 2014.

Wireless connectivity technologies are well-established in many electronic device markets. Bluetooth, Wi-Fi, and GPS are becoming ubiquitous in certain devices, such as smartphones, with attach rates approaching 100% in some cases. Rapid growth is forecast for newer technologies such as NFC and 802.15.4. Wireless connectivity technologies also continue to progress at a fast pace, with new developments such as Bluetooth v4.0 (with low energy being a key facet) and Wi-Fi moving to the 802.11ac standard and 802.11ad coming in the future. As attach rates increase, combinations of different wireless connectivity technologies have been developed to address the needs of customers. "Combo ICs" have become increasingly important, particularly in the smartphone, laptop, and media tablet markets (among others). Standalone ICs are not dead, however, and there are many compelling reasons that not all markets will to move to combo ICs.

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