David Vye, MWJ Editor
David Vye, MWJ Editor RSS FeedRSS

vye_tsinghua

David Vye is responsible for Microwave Journal's editorial content, article review and special industry reporting. Prior to joining the Journal, Mr. Vye was a product-marketing manager with Ansoft Corporation, responsible for high frequency circuit/system design tools and technical marketing communications. He previously worked for Raytheon Research Division and Advanced Device Center as a Sr. Design Engineer, responsible for PHEMT, HBT and MESFET characterization and modeling as well as MMIC design and test. David also worked at M/A-COM's Advanced Semiconductor Operations developing automated test systems and active device modeling methods for GaAs FETs. He is a 1984 graduate of the University of Massachusetts at Dartmouth, with a concentration in microwave engineering.

Highly Integrated Chip and Platform Solutions From Infineon

February 12, 2009
by MWJ European Editor, Richard Mumford

Infineon’s Wireless Solutions Division is a leading provider of semiconductors and system solutions to serve the growing trends in the mobile communication market. In Hall 1, Stand B19 the company will present its highly integrated semiconductor solutions, complete systems platforms and Software products. The focus will be on highlighting different ‘flavours’ of ultra low-cost mobile phone platforms, ranging from 2G to 3G and something new in positioning technology, the A-GPS solution.

Experts will be on hand to discuss the company’s comprehensive cellphone semiconductor and system-level offering ranging from integrated single-chip GSM/GPRS/EDGE solutions to slim HSDPA/HSUPA modem platforms.

Other highlights include:
● Infineon's road to LTE
● Comprehensive cellular transceiver portfolio covering all bands and all modes from GPRS up to LTE and WiMAX
● Smallest HSPA+ RF solutions for best-in-class cellular talk time
● Smart modems for smart phones: HSPA modem platforms combining high performance and small footprint
● More voice: comprehensive ULC platforms with innovations for even lower costs
● Internet-for-all: entry phone platforms with a common architecture from GPRS to low-cost 3G
You must login or register in order to post a comment.