David Vye, MWJ Editor
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David Vye is responsible for Microwave Journal's editorial content, article review and special industry reporting. Prior to joining the Journal, Mr. Vye was a product-marketing manager with Ansoft Corporation, responsible for high frequency circuit/system design tools and technical marketing communications. He previously worked for Raytheon Research Division and Advanced Device Center as a Sr. Design Engineer, responsible for PHEMT, HBT and MESFET characterization and modeling as well as MMIC design and test. David also worked at M/A-COM's Advanced Semiconductor Operations developing automated test systems and active device modeling methods for GaAs FETs. He is a 1984 graduate of the University of Massachusetts at Dartmouth, with a concentration in microwave engineering.

Fifth Annual Device Packaging Conference

March 3, 2009

The Fifth Annual Device Packaging Conference (DPC2009) will be held in Scottsdale, Arizona, on March 9-12, 2009. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS). The conference provides a focused forum on the latest technological developments in 6 topic areas related to microelectronic packaging: 3D Packaging; Flip Chip; Wafer Level Packaging; MEMS; BioMedical Devices; and Power LED Devices. While the majority of technical sessions seem to be focused on fabrication, reliability and thermal issues (i.e. Impact of Underfill Design on Package Reliability), advanced packaging technology certainly impacts multi-chip manufacturers. A couple of talks from the technical sessions caught my eye, including:

Tunable Millimeter-Wave Device Based on Waveguide-Packaged MEMS

Compact Square Patch Antenna for Mobile Application

In the poster sessions, look for:

RF and Thermal Analysis of Packaged TGA4046 Q Band Amplifier

Design of Tunable Filter Structures using Multilayer Low Temperature Cofired Ceramics (LTCC)

A Unique Process for Hermetic Wafer Level Packaging

The full conference and exhibition information is at:

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