Gary Lerude, MWJ Technical Editor
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Gary Lerude

Gary Lerude is the Technical Editor of Microwave Journal. Previously, he spent his career as a “midwife” aiding the growth of the compound semiconductor industry, from device to application, from defense to commercial. He spent 19 years at Texas Instruments, 11 years at MACOM and six years with TriQuint. Gary holds a bachelor’s in EE, a master’s in systems engineering and an engineers degree (ABD) in EE.

Qorvo Helping Validate mmWave in Handsets

Qorvo's mobile products segment is helping validate the use of mmWave in the handset, building prototypes to demonstrate the capability and assess the effects of thermal dissipation and power efficiency. Although multiple carriers have deploying mmWave, Eric Creviston, president of the mobile segment, said mmWave in the handset has not yet been proven.


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Broadcom Gets RF Supply Agreements With Apple

Broadcom has negotiated two multi-year agreements to supply wireless components to Apple, complementing a similar agreement announced last June. Broadcom said the three agreements could generate revenue of some $15 billion over their three-and-a-half year lifetime.


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Broadcom’s Wireless Business for Sale?

During Broadcom's Q4 earnings call last week, CEO Hock Tan classified the wireless segment as a financial asset, implying the business could be sold. The Wall Street Journal reported this week that Broadcom is, indeed, seeking a buyer.


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Fear of Huawei Creating an International Digital Divide

U.S. fears that Huawei is an existential threat to the security of western democracies have precipitated a series of events building a digital divide, a divide separating the communications networks using Huawei equipment from those where it is shunned. A long-term resolution will require a broad cybersecurity agreement between the U.S. and China, one based on trust and verification.


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MACOM Updates GaN Strategy

During MACOM’s earnings call yesterday, CEO Steve Daly reiterated MACOM’s commitment to GaN on Si technology, particularly for high volume, price sensitive, massive MIMO power amplifiers. He also said MACOM will design products with GaN on SiC, for higher power, higher frequency, military and satellite applications.


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