Ampleon announced the availability of a new package platform that will be rolled out across the entire LDMOS and GaN product portfolio. Over a dozen variants of the SOT502 and SOT539 platforms are in development.
Ampleon announced the availability of the BLCU188XRS, a 1400W, CW capable, high power extremely rugged transistor constructed in a thermally optimized air cavity ACP3 copper flanged plastic package. Able to withstand extremely load mismatches, up to a VSWR > 65:1, this Gen6 HV 50 V LDMOS device has a 30 percent better thermal resistance (R,th) compared to a traditional air cavity ceramic packaged transistor, and combined with its high efficiency, requires less stringent cooling requirements.
Ampleon announced details of its participation at the forthcoming IEEE MTT International Microwave Symposium (IMS) held in San Francisco 22 – 27 May, 2016. On display at booth 2149 will be the latest innovations in power amplifier solutions for mobile broadband applications, Doherty amplifiers for use in broadcast and new product concepts such as pallets for S-Band radar applications. Also showcased will be products housed in thermally optimized packages addressing industrial and medical applications
Collaboration between Ampleon and Midea into the use of solid state technology for compact oven design has resulted in Midea launching what is believed to be the first commercially available solid state RF energy oven.