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AtlanTecRF has launched a plug-in 6U Loop Test Translator (LTT) for satcom RF testing. The traditional configuration for loop test translators used in off-satellite set up, calibration, alignment and quality monitoring of ground based equipment in satcom terminals is the 19” x 1U rack mount chassis. In other applications such packaging does not deliver optimum equipment densities or ease of operation. In such situations AtlanTecRF's plug-in 6U Module comes into its own, bringing ATE stacking principles to the satcom RF test world.

Custom MMIC added two low loss, high linearity and high isolation MMIC mixers to their growing family of fundamental, I/Q and image rejection mixers.

National Instruments (NI) announced a baseband model of the second-generation vector signal transceiver (VST). The PXIe-5820 module is the industry’s first baseband VST with 1 GHz of complex I/Q bandwidth and is designed to address the most challenging RF front-end module and transceiver test applications, such as envelope tracking, digital predistortion and 5G test.

W. L. Gore & Associates, Inc. (Gore) will present its most extensive collection of new and proven products at the largest international air show in Paris, June 19-25, at Hall 2B, Stand F170.

At the 2017 International Microwave Symposium, Peregrine Semiconductor Corp. introduced the UltraCMOS® PE42823, a high power receiver protection RF switch. Targeting wireless infrastructure applications, the reflective switch is optimized for emerging radio architectures such as massive MIMO.

Analog Devices, Inc. (ADI) announced the latest update to its RadioVerse™ technology and design ecosystem, which simplifies and accelerates radio development for wireless carriers and telecommunications equipment manufacturers, as they transition their cellular base stations from 4G to 5G.

Quad Industries, Agfa, imec and TNO announced that they have demonstrated a plastic 12-bit RFID tag and read-out system with screen-printed circuitry.

The Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced the addition of the European Radar Summit to its conference program at the Hynes Convention Center, September 11-13 in Boston, Mass.

Smiths Interconnect will be in Booth #1441 at the International Microwave Symposium (IMS) in Honolulu, Hawaii, and one of the many integrated microwave assemblies (IMAs) that they will be talking about includes a recently released Ku-Band High Power Transceiver (HPT).

W. L. Gore & Associates (Gore) continues to enhance the company’s microwave/RF solutions to operate at higher frequencies while performing reliably over time.